La keynote des rouges vient de se terminer et c’est officiel, la nouvelle microarchitecture Zen 5 débarquera sous la forme des Ryzen 9000 en juillet prochain ! De quoi mettre l’eau à la bouche des joueurs en remplaçant le vieillissant Zen 4, dont l’annonce avait été également faite lors du Computex...
Avant l’analyse détaillée (pas de panique, c’est pour dans trèèèès bientôt), Hardware & Co est présent à l’occasion de la keynote d’AMD au Computex, dans laquelle tous les composants attendus ont été dévoilés ! Zen 5 est à la fête avec pas moins de 4 CPU dont un Ryzen 9950X (16 cœurs/32 thread)...
© PHOTO VIOLETTE FRENCH/THE NEW YORK TIMES
© Dessin de Z paru dans Débat Tunisie, Tunis
© Dessin d’Eva Vázquez paru dans “El País”, Madrid.
© Photo Guglielmo Mangiapane/REUTERS
In a packed presentation kicking off this year’s Computex trade show, AMD CEO Dr. Lisa Su spent plenty of time focusing on the subject of AI. And while the bulk of that focus was on AMD’s impending client products, the company is also currently enjoying the rapid growth of their Instinct lineup of accelerators, with the MI300 continuing to break sales projections and growth records quarter after quarter. It’s no surprise then that AMD is looking to move quickly then in the AI accelerator space, both to capitalize on the market opportunities amidst the current AI mania, as well as to stay competitive with the many chipmakers large and small who are also trying to stake a claim in the space.
To that end, as part of this evening’s announcements, AMD laid out their roadmap for their Instinct product lineup for both the short and long term, with new products and new architectures in development to carry AMD through 2026 and beyond.
On the product side of matters, AMD is announcing a new Instinct accelerator, the HBM3E-equiipped MI325X. Based on the same computational silicon as the company’s MI300X accelerator, the MI325X swaps out HBM3 memory for faster and denser HBM3E, allowing AMD to produce accelerators with up to 288GB of memory, and local memory bandwidths hitting 6TB/second.
Meanwhile, AMD also showcased their first new CDNA architecture/Instinct product roadmap in two years, laying out their plans through 2026. Over the next two years AMD will be moving very quickly indeed, launching two new CDNA architectures and associated Instinct products in 2025 and 2026, respectively. The CDNA 4-powered MI350 series will be released in 2025, and that will be followed up by the even more ambitious MI400 series in 2026, which will be based on the CDNA "Next" architecture.
During AMD's opening keynote at Computex 2024, company CEO Dr. Lisa Su revealed AMD's latest AI PC-focused chip lineup for the mobile market, the Ryzen AI 300 series. Based on AMD's new Zen 5 CPU microarchitecture, the Ryzen AI 300 series – codenamed Strix Point – is intended to offer an across-the-board improvement in mobile SoC performance, with AMD proclaiming that the Ryzen AI 300 series will offer the fastest AI inference performance within the compact and portable PC market.
Under the hood, the new mobile SoC from AMD incorporates not only their new Zen 5 CPU architecture, but also their new RDNA 3.5-based integrated graphics, and the third generation XDNA2-based NPU, the latter of which is rated to deliver 50 TOPS of performance for AI-based workloads. As a result, the Ryzen AI 300 series represents a significant upgrade in AMD's mobile chip lineup, with all of the major aspects of the platform receiving a major upgrade versus their Zen 4-era Phoenix/Hawk Point SoCs. The one thing the new platform won't get, however, is a process node improvement; AMD is building Strix Point on a 4nm node, just like Phoenix/Hawk Point before it.
For this morning's announcement, AMD has unveiled the first two Ryzen AI 300 SKUs designed for notebooks. The first of these is the Ryzen AI 9 HX 370, which features 12 Zen 5 cores with a maximum boost frequency of up to 5.1 GHz, and comes equipped with 36 MB cache (12 MB L2 + 24 MB L3). The other chip to be announced is the Ryzen AI 9 365, which has two fewer Zen 5 cores (10 cores) and operates with a 5,0 GHz boost frequency and a 10 MB L2 + 24 MB L3 cache allocation.
During AMD's Computex 2024 kick-off keynote, AMD's CEO, Dr. Lisa Su, officially unveiled and announced the company's next generation of Ryzen processors. Today marks the first unveiling of AMD's highly anticipated Zen 5 microarchitecture via the Ryzen 9000 series, which is set to bring several advancements over Zen 4 and the Ryzen 7000 series for desktop PCs, which will launch sometime in July 2024.
AMD has unveiled four new chip SKUs using its Zen 5 microarchitecture. The AMD Ryzen 9 9950X processor will be the new consumer flagship part, featuring 16 CPU cores and a speedy 5.7 GHz maximum boost frequency. The other SKUs include, 6, 8, and 12 core parts, giving users a varied combination of core and thread counts. All four of these initial chips will be X-series chips, meaning they will have an unlocked multipliers and higher TDPs/clockspeeds.
In regards to performance, AMD is touting an average (geomean) IPC increase in desktop workloads for Zen 5 of 16%. And with the new desktop Ryzen chips' turbo clockspeeds remaining largely identical to their Ryzen 7000 predecessors, this should translate into similar performance expectations for the new chips.
The AMD Ryzen 9000 series will also launch on the AM5 socket, which debuted with AMD's Ryzen 7000 series and marks AMD's commitment to socket/platform longevity. Along with the Ryzen 9000 series will come a pair of new high-performance chipsets: the X870E (Extreme) and the regular X870 chipsets. The fundamental features that vendors will integrate into their specific motherboards remain tight-lipped. Still, we do know that USB 4.0 ports are standard on the X870E/X870 boards, along with PCIe 5.0 for both PCIe graphics and NVMe storage, with higher AMD EXPO memory profile support expected than previous generations.
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