À l’occasion du Computex, AMD a dévoilé ses deux nouvelles armes : les Ryzen 9000 et les Ryzen AI 300, respectivement pour PC de bureau et laptop. Une annonce que nous avons suivi en direct, avant de vous proposer un décorticage de l’intérieur — en attendant plus de détails de la part de la firme. C...
A l'occasion du Computex 2024, notre partenaire 1FODISCOUNT. L'occasion pour vous de parcourir le site de ce e-comerçant français et de profiter de quelques points de réduction sur de très nombreux produits. C'est donc à vous de joueur. Les codes promotions sont valables toute cette semaine. […]
Lire la suiteFor our second keynote of the day for Computex, we have the 4th Musketeer of the great PC powers, Qualcomm. Slated to be the most PC-focused of the four keynotes, company CEO Cristiano Amon will be presenting a keynote entitled “The PC Reborn.” And while Amon is no stranger to giving keynotes, this is slated to be his most PC-centric keynote yet, giving Computex attendees a clearer idea of how focused Qualcomm will be on the PC market with their new Windows-on-Arm SoCs.
The big focus for today's keynote is expected to be the Snapdragon X Elite and X Plus SoCs, which Qualcomm announced over half a year ago, and has been touting ever since. Now, the first consumer devices based on these chips are just a couple of weeks away from shipping, so Qualcomm is in their final promotional push for their new Windows-on-Arm platform. As a result, Qualcomm should have a lot more hardware to show off, with final silicon and shipping SKUs already defined.
While Snapdragon X is not Qualcomm’s first effort to ship an Arm-based SoC for Windows devices – there are 3 generations of 8cx Gen 3 platforms that everyone is happy never to mention again – the Snapdragon X is Qualcomm’s most serious effort yet. At its core is the new, high-performance/high-efficiency Oryon CPU core, which combined with the rest of Qualcomm’s tried-and-true mobile hardware experience, the company is hoping to mold into a revolutionary Arm-based SoC for Windows laptops. The company is also counting on a decade of software development on Microsoft’s part to make the Windows-on-Arm ecosystem whole, not to mention as frictionless as possible.
Besides energy efficiency, Qualcomm’s other big push is on the burgeoning field of NPUs. The Snapdragon X NPU is rated to deliver 45 TOPS of INT8 performance, which makes it the first PC NPU to meet Microsoft’s hardware requirement for Windows 11 Copilot+ AI functionality. So Qualcomm is looking to leverage this time-limited opportunity to be the first to offer new functionality in the Windows space – a privilege normally reserved for Intel or AMD.
Come join us at 10:30pm PT / 01:30am ET / 05:30 UTC to get all the details.
AMD n'a toujours pas dit son dernier mot avec les plateformes AM4 en annonçant deux nouveaux processeurs à destination de leur ancienne plateforme. AMD assure qu'ils sont capables de rivaliser, voire, être meilleurs que les 13600K et 13700K de la concurrence. Ces nouveaux venus restent donc en ZEN 3 et exploiteront de la mémoire de type DDR4. […]
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Grand jour pour les machines compactes et nomades avec l'annonce par AMD des nouveaux processeurs Ryzen AI, avec le Ryzen AI 9 en star. Et surtout seule gamme dévoilée pour l'instant, avec les Ryzen AI 9 HX 370 et Ryzen AI 9 365. Difficile de passer à côté, AMD profite de cette nouvelle génération pour changer de nomenclature : Ryzen AI pour la marque, 9 HX ou 9 pour la gamme, 3 pour la génération et enfin les deux derniers chiffres pour la référence du modèle. Bien entendu, cela ne donne pas toutes les informations et il faut donc aller plus loin pour tout savoir. […]
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AMD a donc annoncé ses nouveaux processeurs Ryzen 9000 durant sa conférence de presse au Computex 2024. Comme les leaks l'avait déjà annoncé, nous allons avoir le droit à 4 nouvelles références, avec les Ryzen 5 9600X, Ryzen 7 9700X, Ryzen 9 9900X et Ryzen 9 9950X. Des processeurs qui débarqueront dans nos PC au moins de juillet prochain, accompagnés de nouveaux chipsets, les X870 et X870E. Avec cette nouvelle architecture, AMD nous propose un IPC en hausse de 16% par rapport à l'architecture ZEN 4. […]
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While the bulk of AMD’s Computex presentation was on CPUs and their Instinct lineup of dedicated AI accelerators, the company also has a small product refresh for the professional graphics and workstation AI crowd. AMD is releasing a dual-slot version of their high-end Radeon Pro W7900 card – aptly named the W7900 Dual Slot – with the intent being to improve compute density in workstations by making it possible to install 4 of the cards inside a single chassis.
The release of a dual-slot version of the card comes after the original Radeon Pro W7900 was the first time AMD went with a larger, triple-slot form factor for their flagship workstation card. With the W7000 generation bringing an all-around increase in power consumption, pushing the W7900 to 295 Watts, AMD originally opted to release a larger card for improved acoustics. However this came at the cost of compute density, as most systems could only fit 2 of the thicker cards. As a result, AMD is opting to release a dual-slot version of the hardware as well, to offer a more competitive product for high-density workstation systems – particularly those doing local AI inference.
| AMD Radeon Pro Specification Comparison | ||||||
| AMD Radeon Pro W7900DS | AMD Radeon Pro W7900 | AMD Radeon Pro W7800 | AMD Radeon Pro W6800 | |||
| ALUs | 12288 (96 CUs) |
8960 (70 CUs) |
3840 (60 CUs) |
|||
| ROPs | 192 | 128 | 96 | |||
| Boost Clock | 2.495GHz | 2.495GHz | 2.32HHz | |||
| Peak Throughput (FP32) | 61.3 TFLOPS | 45.2 TFLOPS | 17.8 TFLOPS | |||
| Memory Clock | 18 Gbps GDDR6 | 18 Gbps GDDR6 | 16 Gbps GDDR6 | |||
| Memory Bus Width | 384-bit | 256-bit | 256-bit | |||
| Memiry Bandwidth | 864GB/sec | 576GB/sec | 512GB/sec | |||
| VRAM | 48GB | 32GB | 32GB | |||
| ECC | Yes (DRAM) |
Yes (DRAM) |
Yes (DRAM) |
|||
| Infinity Cache | 96MB | 64MB | 128MB | |||
| Total Board Power | 295W | 260W | 250W | |||
| Manufacturing Process | GCD: TSMC 5nm MCD: TSMC 6nm |
GCD: TSMC 5nm MCD: TSMC 6nm |
TSMC 7nm | |||
| Architecture | RDNA3 | RDNA3 | RDNA2 | |||
| GPU | Navi 31 | Navi 31 | Navi 21 | |||
| Form Factor | Dual Slot Blower | Triple Slot Blower | Dual Slot Blower | Dual Slot Blower | ||
| Launch Date | 06/2024 | Q2'2023 | Q2'2023 | 06/2021 | ||
| Launch Price (MSRP) | $3499 | $3999 | $2499 | $2249 | ||
Other than the narrower cooler, the Radeon Pro W7900DS is for all intents and purposes identical to the original W7900, with the same Navi 31 GPU being driven to the same clockspeeds, and the overall board being run to the same 295 Total Board Power (TBP) limit. This is paired with the same 18Gbps GDDR6 as before, giving the card 48GB of VRAM.
Officially, AMD doesn’t have a noise specification for these cards. But you can expect that the W7900DS will be louder than its triple-slot senior. By all appearances, AMD is just using the cooler from the W7800, which was a dual-slot card from the start, so that cooler is being tasked with handling another 35W of heat dissipation.
As the W7800 was also AMD’s fastest dual-slot card up until now, it’s an apt point of comparison for compute density. With its full-fat Navi 31 GPU, the W7900DS will offer about 36% more compute/pixel throughput than its sibling/predecessor. So it’s a not-insubstantial improvement for the very specific niche AMD has in mind for the card.
And like so many other things being announced at Computex this year, that niche is AI. While AMD offers PCIe versions of their Instinct MI210 accelerators, those cards are geared at servers, with fully-passive coolers to match. So workstation-level compute is largely picked up by AMD’s Radeon Pro workstation cards, which are intended to go into a traditional PC chassis and use active cooling (blowers). In this case, AMD is specifically going after local inference workloads, as that’s what the Radeon hardware and its significant VRAM pool are best suited for.
The Radeon Pro W7900 Dual Slot will drop on June 19th. Notably, AMD is introducing the card at a slightly lower price tag than they launched the original W7900 at last year, with the W7900DS hitting retail shelves at $3499, down from the W7900’s original $3999 price tag.
Alongside the release of the W7900DS, AMD is also promoting the upcoming Radeon release of ROCm 6.1, their software stack for GPU computing. While baseline ROCm 6.1 was introduced back in April, the Windows version of AMD’s software stack is still a trailing (and feature limited) release. So that is slated to finally get bumped up to a ROCm 6.1 release on June 19th, the same day the W7900DS launches.
ROCm 6.1 for Radeons is slated to bring a couple of major changes/improvements to the stack, particularly when it comes to expanding the scope of available features. Notably, AMD will finally be shipping Windows Subsystem for Linux 2 (WSL2) support, albeit at a beta level, allowing Windows users to access the much richer feature set and software ecosystem of ROCm under Linux. This release will also incorporate improved support for multi-GPU configurations, perfect timing for the launch of the Radeon Pro W7900DS.
Finally, ROCm 6.1 sees TensorFlow integrated into the ROCm software stack as a first-class citizen. While this matter involves more complexities than can be summarized in a simple news story, native TensorFlow support under Windows was previously blocked by a lack of a Windows version of AMD’s MIOpen machine learning library. Combined with WSL2 support, developers will have two ways to access TensorFlow on Windows systems going forward.
During their opening keynote at Computex 2024, AMD announced their intention to launch a pair of new Ryzen 5000 processors for their legacy AM4 platform. The new chips, both getting the XT suffix, will be the Ryzen 9 5900XT, a 16 core Zen 3 part, while the Ryzen 7 5800XT will be an 8 core Zen 3.
The new chips are intended to underscore AMD's ongoing commitment to supporting their consumer platforms over several years. And while the specification changes are rather minor overall – the Zen 3 CPU architecture has long since been taken as far as it can reasonable go – it does give AMD a chance to refresh the platform by slinging hardware at new price points. AMD did something very similar for the Ryzen 3000 generation with the late-model Ryzen 3000 XT chips.
| AMD Ryzen 5000XT Series Processors (Zen 3) |
||||||
| AnandTech | Cores / Threads |
Base Freq |
Turbo Freq |
L2 Cache |
L3 Cache |
TDP |
| Ryzen 9 5950X | 16C / 32T | 3.4 GHz | 4.9 GHz | 8 MB | 64 MB | 105 W |
| Ryzen 9 5900XT | 16C / 32T | 3.3 GHz | 4.8 GHz | 8 MB | 64 MB | 105 W |
| Ryzen 9 5900X | 12C / 24T | 3.7 GHz | 4.8 GHz | 6 MB | 64 MB | 105 W |
| Ryzen 7 5800XT | 8C / 16T | 3.8 GHz | 4.8 GHz | 4 MB | 32 MB | 105 W |
| Ryzen 7 5800X | 8C / 16T | 3.8 GHz | 4.7 GHz | 4 MB | 32 MB | 105 W |
We've dedicated many column inches covering Zen 3 and the Ryzen 5000 series since they launched in late 2020, so there isn't anything new to add here. Zen 3 is no longer AMD's latest and greatest, but the platform as a whole is quite cheap to produce, making it a viable budget offering for new builds, or offering one last upgrade for old builds.
The Ryzen 9 5900XT is a 16 core part, and isn't to be confused with the Ryzen 9 5900X, which is a 12 core part. It ships with a peak turbo clockspeed of 4.8GHz, 100 MHz lower than the top-tier Ryzen 9 5950X. This makes it's XT designation somewhat of a misnomer compared to previous generations of XT chips, although it's clear that AMD has boxed themselves into a corner with their naming scheme, as they both need a way to designate that this is a new chip, and yet still place it below the 5950X.
Looking at the second chip, we have the Ryzen 7 5800XT. This is an 8 core part that does improve on its predecessor, offering a 4.8GHz max turbo clock that is 100MHz higher than the Ryzen 7 5800X's. Both chips otherwise share the same characteristics, including 6 MB of L2 cache and 32 MB of L3 cache, and all four of the chips – including the two new XT series and the corresponding X series chips – all come with a 105 Watt TDP.
In terms of motherboard compatibility, all of the AM4 motherboards that currently support the Ryzen 5000 series are also compatible with the Ryzen 5000XT series, although users are likely to need to perform a firmware update to ensure maximum compatibility; they are the same chips, but the microcodes are likely different.
AMD has provided some gaming performance figures comparing the Ryzen 9 5900XT to Intel's 13th Gen Core i7-13700K. It does offer very modest yet marginal gains in games by up to 4%; it's not mind-blowing, but the price could be the decisive factor here.
Regarding price, AMD hasn't disclosed anything official yet ahead of the expected launch of the Ryzen 5000XT series chips in July. It's hard to make a case for a pair of chips to be considered a fully-fledged series, but it does open up the doors for AMD to perhaps launch more 5000XT series chips in the future.
Read more of this story at Slashdot.
La keynote des rouges vient de se terminer et c’est officiel, la nouvelle microarchitecture Zen 5 débarquera sous la forme des Ryzen 9000 en juillet prochain ! De quoi mettre l’eau à la bouche des joueurs en remplaçant le vieillissant Zen 4, dont l’annonce avait été également faite lors du Computex...
Avant l’analyse détaillée (pas de panique, c’est pour dans trèèèès bientôt), Hardware & Co est présent à l’occasion de la keynote d’AMD au Computex, dans laquelle tous les composants attendus ont été dévoilés ! Zen 5 est à la fête avec pas moins de 4 CPU dont un Ryzen 9950X (16 cœurs/32 thread)...
In a packed presentation kicking off this year’s Computex trade show, AMD CEO Dr. Lisa Su spent plenty of time focusing on the subject of AI. And while the bulk of that focus was on AMD’s impending client products, the company is also currently enjoying the rapid growth of their Instinct lineup of accelerators, with the MI300 continuing to break sales projections and growth records quarter after quarter. It’s no surprise then that AMD is looking to move quickly then in the AI accelerator space, both to capitalize on the market opportunities amidst the current AI mania, as well as to stay competitive with the many chipmakers large and small who are also trying to stake a claim in the space.
To that end, as part of this evening’s announcements, AMD laid out their roadmap for their Instinct product lineup for both the short and long term, with new products and new architectures in development to carry AMD through 2026 and beyond.
On the product side of matters, AMD is announcing a new Instinct accelerator, the HBM3E-equiipped MI325X. Based on the same computational silicon as the company’s MI300X accelerator, the MI325X swaps out HBM3 memory for faster and denser HBM3E, allowing AMD to produce accelerators with up to 288GB of memory, and local memory bandwidths hitting 6TB/second.
Meanwhile, AMD also showcased their first new CDNA architecture/Instinct product roadmap in two years, laying out their plans through 2026. Over the next two years AMD will be moving very quickly indeed, launching two new CDNA architectures and associated Instinct products in 2025 and 2026, respectively. The CDNA 4-powered MI350 series will be released in 2025, and that will be followed up by the even more ambitious MI400 series in 2026, which will be based on the CDNA "Next" architecture.
During AMD's opening keynote at Computex 2024, company CEO Dr. Lisa Su revealed AMD's latest AI PC-focused chip lineup for the mobile market, the Ryzen AI 300 series. Based on AMD's new Zen 5 CPU microarchitecture, the Ryzen AI 300 series – codenamed Strix Point – is intended to offer an across-the-board improvement in mobile SoC performance, with AMD proclaiming that the Ryzen AI 300 series will offer the fastest AI inference performance within the compact and portable PC market.
Under the hood, the new mobile SoC from AMD incorporates not only their new Zen 5 CPU architecture, but also their new RDNA 3.5-based integrated graphics, and the third generation XDNA2-based NPU, the latter of which is rated to deliver 50 TOPS of performance for AI-based workloads. As a result, the Ryzen AI 300 series represents a significant upgrade in AMD's mobile chip lineup, with all of the major aspects of the platform receiving a major upgrade versus their Zen 4-era Phoenix/Hawk Point SoCs. The one thing the new platform won't get, however, is a process node improvement; AMD is building Strix Point on a 4nm node, just like Phoenix/Hawk Point before it.
For this morning's announcement, AMD has unveiled the first two Ryzen AI 300 SKUs designed for notebooks. The first of these is the Ryzen AI 9 HX 370, which features 12 Zen 5 cores with a maximum boost frequency of up to 5.1 GHz, and comes equipped with 36 MB cache (12 MB L2 + 24 MB L3). The other chip to be announced is the Ryzen AI 9 365, which has two fewer Zen 5 cores (10 cores) and operates with a 5,0 GHz boost frequency and a 10 MB L2 + 24 MB L3 cache allocation.
During AMD's Computex 2024 kick-off keynote, AMD's CEO, Dr. Lisa Su, officially unveiled and announced the company's next generation of Ryzen processors. Today marks the first unveiling of AMD's highly anticipated Zen 5 microarchitecture via the Ryzen 9000 series, which is set to bring several advancements over Zen 4 and the Ryzen 7000 series for desktop PCs, which will launch sometime in July 2024.
AMD has unveiled four new chip SKUs using its Zen 5 microarchitecture. The AMD Ryzen 9 9950X processor will be the new consumer flagship part, featuring 16 CPU cores and a speedy 5.7 GHz maximum boost frequency. The other SKUs include, 6, 8, and 12 core parts, giving users a varied combination of core and thread counts. All four of these initial chips will be X-series chips, meaning they will have an unlocked multipliers and higher TDPs/clockspeeds.
In regards to performance, AMD is touting an average (geomean) IPC increase in desktop workloads for Zen 5 of 16%. And with the new desktop Ryzen chips' turbo clockspeeds remaining largely identical to their Ryzen 7000 predecessors, this should translate into similar performance expectations for the new chips.
The AMD Ryzen 9000 series will also launch on the AM5 socket, which debuted with AMD's Ryzen 7000 series and marks AMD's commitment to socket/platform longevity. Along with the Ryzen 9000 series will come a pair of new high-performance chipsets: the X870E (Extreme) and the regular X870 chipsets. The fundamental features that vendors will integrate into their specific motherboards remain tight-lipped. Still, we do know that USB 4.0 ports are standard on the X870E/X870 boards, along with PCIe 5.0 for both PCIe graphics and NVMe storage, with higher AMD EXPO memory profile support expected than previous generations.
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