As the first quarter of 2024 is already well underway, there's not been much in the way of launches since last year. Of particular note is AMD's launch of their Ryzen 8000G series APUs, which are based on their mobile silicon using the Zen 4 architecture. This release adds a different dynamic to the CPU market, with AMD building on their still popular Ryzen 5000G series of APUs, which still regularly feature as some of the best-selling CPUs on the market despite their age. With the Ryzen 7 8700G (8C/16T) and Ryzen 5 8600G (6C/12T), which we reviewed, AMD combines their Phoenix silicon with the latest Radeon RDNA3 integrated graphics into a desktop package designed for their AM5 platform.

Last year (October), we also saw Intel introduce their 14th Gen Core family, headlined by the Core i9-14900K with its impressive 6.0 GHz speed. AMD's Ryzen 7000 series continues to fiercely compete at the high end of the market, offering CPU enthusiasts and gamers on all budgets a wide range of processors to select from. The availability of processors, motherboards, and DDR5 memory remains strong at key retailers, ensuring that the current market is well-prepared to meet the high demand. As we go into 2024, the CPU market shows a somewhat strong and diverse outlook, with various options for consumers of all ilks.

Virtually all client SSDs with a PCIe 5.0 x4 interface released to date use Phison's PS5026-E26 controller. Apparently, TeamGroup decided to try something different and introduced a drive powered by a completely different platform, the Innogrit IG5666. The T-Force Ge Pro SSD not only uses an all-new platform, but it also boasts with fast 3D NAND to enable a sequential read speed of up to 14 GB/s, which almost saturates the PCIe 5.0 x4 bus.

TeamGroup's T-Force Ge Pro PCIe 5.0 SSDs will be among the first drives to use the Innogrit IG5666 controller, which packs multiple cores that can handle an LDPC ECC algorithm with a 4096-bit code length, features low power consumption, has eight NAND channels, is made on a 12 nm-class process technology, and has a PCIe 5.0 x4 host interface. The drives will be available in 1 TB, 2 TB, and 4 TB configurations as well as will rely on high-performance 3D TLC NAND memory with a 2400 MT/s interface speed to guarantee maximum performance.

Indeed, 2 TB and 4TB T-Force Ge Pro drives are rated for an up to 14,000 MB/s sequential read speed as well as an up to 11,800 MB/s sequential write speed, which is in line with the highest-end SSDs based on the Phison E26 controller. Meanwhile, TeamGroup does not disclose random performance offered by these SSDs.

What is noteworthy is that to T-Force Ge Pro drives are equipped with a simplistic graphene heatspreader, which is said to be enough to sustain such high-performance levels under loads. Usage of such a cooler makes it easy to fit a T-Force Ge Pro into almost any system, a major difference with many of Phison E26-based drives. Of course, only reviews will reveal whether such a cooling system is indeed enough to properly cool the SSDs, but the fact that TeamGroup decided to go with a thin cooler is notable.

TeamGroup is set to offer its T-Force Ge Pro SSDs with a five-year warranty. Amazon, Newegg, and Amazon Japan will start taking pre-orders on these drives on February 9, 2024. Prices are currently unknown.

One of the most desired desktop chips designed for low-cost systems has been AMD's APUs or Accelerated Processing Units. The last time we saw AMD launch a series of APUs for desktops was back in 2021, with the release of their Cezanne-based Ryzen 5000G series, which combined Zen 3 cores with Radeon Vega-based integrated graphics. During CES 2024, AMD announced the successor to Cezanne, with new Phoenix-based APUs, aptly named the Ryzen 8000G series.

The latest Ryzen 8000G series is based on their mobile Phoenix architecture and has been refitted for AMD's AM5 desktop platform. Designed to give users and gamers on a budget a pathway to build a capable yet cheaper system without the requirement of a costly discrete graphics card hanging over their head, the Ryzen 8000G series consists of three SKUs, ranging from an entry-level Phoenix 2 based Zen 4 and Zen 4c hybrid chip, all the way to a full Zen 4 8C/16T model with AMD's latest mobile RDNA3 integrated graphics. 

The Ryzen 7 8700G with 8C/16T, 16 MB of L3 cache, and AMD's Radeon 780M graphics are sitting at the top of the pile. The other chip we're taking a look at today is the middle-of-the-road AMD Ryzen 5 8600G, which has a 6C/12T configuration with fully-fledged mobile Zen 4 cores, with a third option limited to just OEMs currently, with four cores, including one full Zen 4 core and three smaller and more efficient Zen 4c cores.

The other notable inclusion of AMD's Ryzen 8000G series is it brings their Ryzen AI NPU into the desktop market for the first time. It is purposely built for AI inferencing workloads such as Generative AI and is optimized and designed to be more efficient and improve AI performance.

Much of the onus on the capability of AMD's Ryzen 8000G series will be how much of an impact the switch to Zen 4 and RDNA3 integrated graphics commands over the Ryzen 5000G series with Zen 3 and Vega, which is already three years old at this point. The other element is how the mobile-based Phoenix Zen 4 cores compare to the full-fat Raphael Zen 4 cores. In our review and analysis of the AMD Ryzen 7 8700G and Ryzen 5 8600G APUs, we aim to find out.

While enthusiasts are now focused mostly on SSDs with a PCIe 5.0 interface, there are many people who will be just fine with drives featuring a PCIe 4.0 interface to upgrade their PlayStation 5 or PCs bought a few years ago. To address these customers, SSD makers need to offer something that offers the right balance between price and performance. This is exactly what Corsair does with its MP600 Elite devices.

Corsair this week has released a new line of SSDs aimed at the mainstream market, the MP600 Elite. The drives are based on Phison's low-power highly-integrated PS5027-E27T platform, which is geared towards building mainstream, DRAM-less drives. The controller supports both 3D TLC and 3D QLC NAND flash via a four channel, Toggle 5.0/ONFi 5.0 interface, with data transfer rates up to 3600 MT/s. Meanwhile host connectivity is provided via a PCIe 4.0 x4 interface.

With its MP600 Elite SSDs, Corsair is not trying to offer the fastest PCIe Gen4 drives on the market, but rather attempts to offer the maximum value for 3D TLC-powered 1 TB, 2 TB as well as 4 TB configurations. The drives will offer sequential read performance of up to 7,000 MB/s and write performance of up to 6,500 MB/s, as well as random read and write speeds of up to 1,000K and 1,200K IOPS respectively, which is not bad for a PCIe Gen4 SSDs.

To maximize compatibility of its MP600 Elite drives (and make it compatible with Sony's PlayStation 5 and PlayStation 5 Slim), Corsair offers them both with a tiny aluminum heatspreader and an even thinner graphene heatspreader.

The main idea behind the Corsair MP600 Elite is its affordability: it does not require DRAM or a sophisticated cooling system, which optimizes the manufacturer's costs. Meanwhile, Corsair offers 1 TB MP600 Elite SSD with a graphene heatspreader for $89.99 and 2 TB MP600 Elite SSD with a graphene heatspreader for $164.99 (whereas versions with an aluminum heatsink are $5 cheaper), which is not particularly cheap. For example, a faster Corsair MP600 Pro LPX 2 TB costs $169.99.

Every drive is comes with a five-year warranty and can endure up to 1,200 terabytes written (TBW).

As part of their quarterly earnings call this week, AMD re-emphasized that its Zen 5-architecture processors for both client and datacenter applications will be available this year. While the company is not making any new disclosured on products or providing a timeline beyond "later this year", the latest statement from AMD serves as a reiteration of AMD's plans, and confirmation that those plans are still on schedule.

So far, we have heard about three Zen 5-based products from AMD: the Strix Point accelerated processing units (APUs) for laptops (and perhaps eventually desktops), the Granite Ridge processors for enthusiast-grade desktops, and Turin CPUs for datacenters. During the conference call with analysts and investors, AMD's Lisa Su confirmed plans to launch Turin and Strix this year.

"Looking ahead, customer excitement for our upcoming Turin family of EPYC processors is very strong," said Lisa Su, chief executive officer of AMD, at the company's earnings call this week (via SeekingAlpha). "Turin is a drop-in replacement for existing 4th Generation EPYC platforms that extends our performance, efficiency and TCO leadership with the addition of our next-gen Zen 5 core, new memory expansion capabilities, and higher core counts."

The head of AMD also confirmed that Turin will be drop-in compatible with existing SP5 platforms (i.e., will come in an LGA 6096 package), feature more than 96 cores, and more memory expansion capabilities (i.e., enhanced support for CXL and perhaps support for innovative DIMMs). Meanwhile, the new CPUs will also offer higher per-core performance and higher performance efficiency.

AMD High Performance CPU Core Roadmap. From AMD Financial Analyst Day 2022

As far as Strix Point is concerned, Lisa Su confirmed that this is a Zen 5 part featuring an 'enhanced RDNA 3' graphics core (also known as Navi 3.5), and an updated neural processing unit.

"Strix combines our next-gen Zen 5 core with enhanced RDNA graphics and an updated Ryzen AI engine to significantly increase the performance, energy efficiency, and AI capabilities of PCs," Su said. "Customer momentum for Strix is strong with the first notebooks on track to launch later this year."

It's notable that the head of AMD did not mention Granite Ridge CPUs foe enthusiast-grade desktops during the conference call. Though as desktop CPUs tend to have smaller margins than mobile or server parts, they are often AMD's least interesting products to investors. Despite that omission, AMD has always launched their consumer desktop chips ahead of their server chips – in part due to the longer validation times required on the latter – so Turin being confirmed for 2024 is still a positive sign for Granite Ridge.

Earlier this week, we published our review of AMD's latest Zen 4 based APUs, the Ryzen 7 8700G and Ryzen 5 8600G. While we saw much better gaming performance using the integrated graphics compared to the previous Ryzen 5000G series of APUs, including the Ryzen 7 5700G, the team over at Gamers Nexus has since highlighted an issue with Skin Temperature-Aware Power Management, or STAPM, for short. This particular issue is something we have investigated ourselves, and we can confirm that there is a throttling issue within the current firmware (at the time of writing) with AMD's Ryzen 8000G APUs.

First, it's essential to understand what the Skin Temperature-Aware Power Management (STAPM) feature is and what it does. Introduced by AMD in back 2014, STAPM is a key feature within their mobile processors. STAPM extends the on-die power management by considering the processor's internal temperatures taken by on-chip thermal diodes and the laptop's surface temperature (i.e. the skin temperature). The primary goal of STAPM is to prevent laptops from becoming uncomfortably warm for users, allowing the processor to actively throttle back its heat generation based on the thermal parameters between the chassis and the processor itself.

This is where things relate directly to AMD's Ryzen 8000G series APUs. The Ryzen 8000G series of APUs is based on AMD's Phoenix silicon, which is already in use in their Ryzen Mobile 7040/8040 chips. Which means all of AMD's initial engineering for the platform was for mobile devices, and then extended to the Ryzen 8000G desktop platform. Besides the obvious physical differences, the Ryzen 8000G APUs feature a much higher 65 W TDP (88W PPT) to reflect their desktop-focused operation, making these chips the least power constrained version of Phoenix to date.

The issue is that AMD has essentially 'forgotten' to disable these STAPM features within their firmware, causing both the Ryzen 8000G APUs' Zen 4 cores and RDNA3 integrated graphics to throttle after prolonged periods of sustained load. As we can see from our investigation of the issue, in F1 2023 at 720p High settings, within 3 minutes of playing, we saw a drop in power by around 22%, which will undoubtedly impact both CPU and the integrated graphics performance during prolonged periods.

This directly affects the data in our review of the AMD Ryzen 7 8700G and Ryzen 5 8600G APUs, as the STAPM issues inherently mean that in very prolonged cases, the results may vary. Unfortunately, this issue apparently affects all AM5 motherboards and BIOSes currently available, so there's no way to properly run a Ryzen 8000G chip without STAPM throttling for the time being.

For the moment, we're putting a disclaimer on our Ryzen 8000G review, noting the issue. Once a fix is available from AMD, we'll be going back and re-testing the two chips we have to collect proper results, as well as to better quantify the performance impact of this unnecessary throttling.

Meanwhile, we reached out to AMD to confirm the issue officially, and a few minutes ago the company got back to us with a response.

"It has come to our attention that STAPM limits are being incorrectly applied to 8000 Series processors. This is causing them to drop their PPT limits under sustained load. We are working on a BIOS update to correct this behavior."

The fix that AMD will seemingly apply is through updated AGESA firmware, which, from their standpoint, should be simple in practice. Perhaps the biggest outstanding question is when this fix is coming, though we can't imagine AMD taking too long with this matter.

We must also thank Gamers Nexus for highlighting and providing additional context to the STAPM-related problems from which the Ryzen 8000G APUs suffer from. The video review from Gamers Nexus of the AMD Ryzen 7 8700G and Ryzen 5 8600 APU can be found above. Once a firmware fix has been provided, we will update our data set within our review of the Ryzen 7 8700G and Ryzen 5 8600G.

NVIDIA today is quietly launching a new entry-level graphics card for the retail market, the GeForce RTX 3050 6GB. Based on a cut-down version of their budget Ampere-architecture GA107 GPU, the new card brings what was previously an OEM-only product to the retail market. Besides adding another part to NVIDIA's deep product stack, the launch of the RTX 3050 6GB also comes with another perk: lower power consumption thanks to this part targeting system installs where an external PCIe power connector would not be needed. NVIDIA's partners, in turn, have not wasted any time in taking advantage of this, and today Palit is releasing its first fanless KalmX board in years: the GeForce RTX 3050 KalmX 6GB.

The GeForce RTX 3050 6GB is based on the GA107 graphics processor with 2304 CUDA cores, which is paired with 6GB of GDDR6 attached to a petite 96-bit memory bus (versus 128-bit for the full RTX 3050 8GB). Coupled with a boost clock rating of just 1470 MHz, the RTX 3050 6GB delivers tangibly lower compute performance than the fully-fledged RTX 3050 — 6.77 FP32 TFLOPS vs 9.1 FP32 TFLOPS — but these compromises offer an indisputable advantage: a 70W power target.

Palit is the first company that takes advantage of this reduced power consumption of the GeForce RTX 3050 6 GB, as the company has launched a passively cooled graphics card based on this part, the first in four years. The Palit GeForce RTX 3050 KalmX 6GB (NE63050018JE-1170H) uses a custom printed circuit board (PCB) that not only offers modern DisplayPort 1.4a and HDMI 2.1 outputs, but, as we still see in some entry-level cards, a dual-link DVI-D connector (a first for an Ampere-based graphics card).

The dual-slot passive cooling system with two heat pipes is certainly the main selling point of Palit's GeForce RTX 3050 KalmX 6GB. The product is pretty large though — it measures 166.3×137×38.3 mm — and will not fit into tiny desktops. Still, given the fact that fanless systems are usually not the most compact ones, this may not be a significant limitation of the new KalmX device.

Another advantage of Palit's GeForce RTX 3050 KalmX 6GB in particular and NVIDIA's GeForce RTX 3050 6GB in general is that it can be powered entirely via a PCIe slot, which eliminates the need for an auxiliary PCIe power connectors (which are sometimes not present in cheap systems from big OEMs).

Wccftech reports that NVIDIA's GeForce RTX 3050 6GB graphics cards will carry a recommended price tag of $169 and indeed these cards are available for $170 - $180. This looks to be a quite competitive price point as the product offers higher compute performance than that of AMD's Radeon RX 6400 ($125) and Radeon RX 6500 XT ($140). Meanwhile, it remains to be seen how much will Palit charge for its uniquely positioned GeForce RTX 3050 KalmX 6GB.

Global client PC CPU shipments hit 66 million units in the fourth quarter of 2024, up both sequentially and year-over-year, a notable upturn in the PC processor market, according to the latest report from Jon Peddie Research. The data indicates that PC makers have depleted their CPU stocks and returned to purchases of processors from Intel during the quarter. This might also highlight that PC makers now have an optimistic business outlook.

AMD, Intel, and other suppliers shipped 66 million processors for client PCs during the fourth quarter of 2023, a 7% increase from the previous quarter (62 million) and a 22% rise from the year before (54 million). Despite a challenging global environment, the CPU market is showing signs of robust health.

70% of client PC CPUs sold in Q4 2023 were aimed at notebooks, which is up significantly from 63% represented by laptop CPUs in Q4 2022. Indeed, notebook PCs have been outselling desktop computers for years, so, unsurprisingly, the industry shipped more laptop-bound processors than desktop-bound CPUs. What is perhaps surprising is that the share of desktop CPUs in Q4 2022 shipments was 37%.

"Q4's increase in client CPU shipments from last quarter is positive news in what has been depressing news in general," said Jon Peddie, president of JPR. "The increase in upsetting news in the Middle East, combined with the ongoing war in Ukraine, the trade war with China, and the layoffs at many organizations, has been a torrent of bad news despite decreased inflation and increased GDP in the U.S. CPU shipments are showing continued gains and are a leading indicator."

Meanwhile, integrated graphics processors (iGPUs) also grew, with shipments reaching 60 million units, up by 7% quarter-to-quarter and 18% year-over-year. Because the majority of client CPUs now feature a built-in GPU in one form or another, it is reasonable to expect shipments of iGPUs to grow along with shipments of client CPUs. 

Jon Peddie Research predicts that iGPUs will dominate the PC segment, with their penetration expected to skyrocket to 98% within the next five years. This forecast may point to a future where integrated graphics become ubiquitous, though we would not expect discrete graphics cards to be extinct. 

Meanwhile, the server CPU segment painted a different picture in Q4 2023, with a modest 2.8% growth from the previous quarter but a significant 26% decline year-over-year, according to JPR. 

Despite these challenges, the overall positive momentum in the CPU market, as reported by Jon Peddie Research, suggests a sector that is adapting and thriving even amidst economic and geopolitical uncertainties.

One area of AMD's product portfolio that doesn't get as much attention as the desktop and server parts is their Embedded platform. AMD's Embedded series has been important for on-the-edge devices, including industrial, automotive, healthcare, digital gaming machines, and thin client systems. Today, AMD has unveiled their latest Embedded architecture, Embedded+, which combines their Ryzen Embedded processors based on the Zen+ architecture with their Versal adaptive SoCs onto a single board.

The Embedded+ architecture integrates the capabilities of their Ryzen Embedded processors with their Versal AI Edge adaptive SoCs onto one packaged board. AMD targets key areas that require good computational power and power efficiency. This synergy enables Embedded+ to handle AI inferencing and manage complex sensor data in real-time, which is crucial for applications in dynamic and demanding environments.

Giving ODMs the ability to have both Ryzen Embedded and their Versal SoCs onto a single board is particularly beneficial for industries requiring low-latency response times between hardware and software, including autonomous vehicles, diagnostic equipment in healthcare, and precision machinery in industrial automation. The AMD Embedded+ architecture can also support various workloads across different processor types, including x86 and ARM, along with AI engines and FPGA fabric, which offers flexibility and scalability of embedded computing solutions within industries.

The Embedded+ platform from AMD offers plenty of compatibility with various sensor types and their corresponding interfaces. It facilitates direct connectivity with standard peripherals and industrial sensors through Ethernet, USB, and HDMI/DP interfaces. The AMD Ryzen Embedded processors within the architecture can handle inputs from traditional image sensors such as RGB, monochrome, and even advanced neuromorphic types while supporting industry-standard image sensor interfaces like MIPI and LVDS.

Further enhancing its capability, the AMD Versal AI Edge adaptive SoCs on the Embedded+ motherboard offer adaptable I/O options for real-time sensor input and industrial networking. This includes interfacing with LiDAR, RADAR, and other delicate and sophisticated sensors necessary for modern embedded systems in the industrial, medical, and automotive sectors. The platform's support for various product-level sensor interfaces, such as GMSL and Ethernet-based vision protocols, means it is designed and ready for integration into complex, sensor-driven systems.

AMD has also announced a new pre-integrated solution, which will be available for ODMs starting today. The Sapphire Technology VPR-4616-MB platform is a compact, Mini-ITX form factor motherboard that leverages the AMD Versal AI Edge 2302 SoC combined with an AMD Ryzen Embedded R2314 processor, which is based on Zen+ and has 4C/4T with 6 Radeon Vega compute units. It features a custom expansion connector for I/O boards, supporting a wide array of connectivity options, including dual DDR4 SO-DIMM slots with up to 64 GB capacity, one PCIe 3.0 x4 M.2 slot, and one SATA port for conventional HDDs and SSDs, The VPR-4616-MB also has a good array of networking capabilities including 2.5 Gb Ethernet and an M.2 Key E 2230 PCIe x1 slot for a wireless interface. It also supports the Linux-based Ubuntu 22.04 operating system.

Also announced is a series of expansion boards that significantly broaden support for the Embedded+ architecture. The Octo GMSL Camera I/O board is particularly noteworthy for its ability to interface with multiple cameras simultaneously. It is undoubtedly suitable for high bandwidth vision-based systems, integral to sectors such as advanced driver-assistance systems (ADAS) and automated surveillance systems. These systems often require the integration of numerous image inputs for real-time processing and analysis, and the Octo GMSL board is engineered to meet this demand specifically.

Additionally, a dual Ethernet I/O board is available, capable of supporting 10/100/1000 Mb connections, catering to environments that demand high-speed network communications. The Dual 10 Gb SFP+ board has 16 GPIOs for even higher bandwidth requirements, providing ample data transfer rates for tasks like real-time video streaming and large-scale sensor data aggregation. These expansion options broaden the scope of what the Embedded+ architecture is capable of in an edge and industrial scenario.

The Sapphire VPR-4616-MB is available for customers to purchase now and in a complete system configuration, including storage, memory, power supply, and chassis.

Taiwan Semiconductor Manufacturing Co. on Tuesday formally announced plans to build a second fab in Japan. The fab will be run by Japan Advanced Semiconductor Manufacturing (JASM), a majority-owned TSMC subsidiary, and will make chips on 6 nm and 7 nm-class process technologies, which will make it the most advanced semiconductor production facility for logic chips in Japan.

JASM is currently gearing up to start operating its first fab in Japan. This semiconductor production facility — set to be formally opened on February 24 — will be able to process up to 55,000 300-mm wafer starts per month (WSPM) using TSMC's 40 nm, 28 nm, 22 nm, 16 nm, and 12 nm-class process technologies. This fab is set to serve needs of JASM's minor investors, such as Sony, Toyota, and Denso, and other Japanese companies, such as automakers.

The new N6 and N7-capable fab will be located adjacent to JASM's upcoming fab in Kumamoto Prefecture, Japan. This facility will increase capacity of the site to over 100,000 300-mm wafer starts per month when it begins operations by the end of calendar 2027, according to TSMC. Capacity of the fab may be adjusted based on demand and other factors.

The initial Fab 23 that is coming online in the coming weeks or months was designed to address needs of Japanese companies like Sony and Toyota and ensure that they do not run into shortages of various commodity chips vital for their products yet not requiring advanced process technologies. The second fab, which is set to adopt 6 nm and 7 nm class process technologies will be able to produce considerably more sophisticated processors and will bring these production nodes for the first time in Japan. Essentially, the announcement of the new fab indicates that JASM is poised to slowly by surely catch up with TSMC's leading-edge fabs in Japan.

To build the new fab, owners of JASM will invest additional money in the venture and their total investments in the site will exceed $20 billion with 'strong support from the Japanese government,' TSMC said. As a result, JASM will be able to produce chips for a wide range of applications, including automotive, industrial, consumer and HPC-related applications.

Under the new investment agreement JASM's ownership will be divided as follows: TSMC will hold the largest stake at 86.5%, followed by SSS at 6.0%, DENSO at 5.5%, and Toyota at 2.0%.

A German court has sided with R2 Semiconductor against Intel, ruling that the chip giant infringed one of R2's patent. This decision could lead to sales ban of select Intel processors as well as products based on them in Germany. Intel, for its part, has accused R2 of being a patent troll wielding a low-quality patent, and has said that it will appeal the decision.

The regional court in Düsseldorf, Germany, ruled that Intel infringed a patent covering an integrated voltage regulator technology that belongs to Palo Alto, California-based R2 Semiconductor. The court on Wednesday issued an injunction against sales of Intel's Core-series 'Ice Lake,' 'Tiger Lake,' 'Alder Lake,' and Xeon Scalable 'Ice Lake Server' processors as well as PCs and servers based on these CPUs. Some of these processors have already been discontinued, but there are Alder Lake chips are available in retail and inside many systems that are still on the shelves. Though the ruling does not mean that these CPUs will disappear from the German market immediately.

Meanwhile, the injunction does not cover Intel's current-generation Core 'Raptor Lake' and Core Ultra 'Meteor Lake' processors for desktops and laptops, according to The Financial Times, so the impact of the injunction is set to be fairly limited.

Intel has expressed its disappointment with the verdict and announced its intention to challenge the decision. The company criticized R2 Semiconductor's litigation strategy, accusing it of pursuing serial lawsuits against big companies, particularly after Intel managed to invalidate one of R2's U.S. patents.

"R2 files serial lawsuits to extract large sums from innovators like Intel," a statement by Intel reads. "R2 first filed suit against Intel in the U.S., but after Intel invalidated R2's low-quality U.S. patent R2 shifted its campaign against Intel to Europe. Intel believes companies like R2, which appears to be a shell company whose only business is litigation, should not be allowed to obtain injunctions on CPUs and other critical components at the expense of consumers, workers, national security, and the economy."

In its lawsuit against Intel, R2 requested the court to halt sales of infringing processors, sales of products equipped with these CPUs, and to mandate a recall of items containing these processors, as Intel revealed last September. The company contended that imposing an injunction would be an excessive response.

Meanwhile, it is important to note that in this legal battle Intel is safeguarding its customers by assuming responsibility for any legal expenses or compensations they may incur. Consequently, as of September, Intel was unable to provide a reliable estimate of the possible financial impact or the scope of potential losses that could result from the legal battle as they can be vast.

In a stark contrast with Intel, R2 welcomes the court's decisions and presents the company's own view on the legal dispute.

"We are delighted that the highly respected German court has issued an injunction and unequivocally found that Intel has infringed R2's patents for integrated voltage regulators," said David Fisher, CEO of R2. "We intend to enforce this injunction and protect our valuable intellectual property. The global patent system is here precisely for the purpose of protecting inventors like myself and R2 Semiconductor."

R2 claims that Intel planned to invest in R2 in 2015, about two years after the company first brought its Fully Integrated Voltage Regulator (FIVR) technology to market with its 4^th Generation Core 'Haswell' processors, but then abandoned talks.

"R2 has been a semiconductor IP developer, similar to Arm and Rambus, for more than 15 years," Fisher said. "Intel is intimately familiar with R2's business — in fact, the companies were in the final stages of an investment by Intel into R2 in 2015 when Intel unilaterally terminated the process. R2 had asked if a technical paper Intel had just published about their approach to their FIVR technology, which had begun shipping in their chips, was accurate. The next and final communication was from Intel's patent counsel. That was when it became clear to me that Intel was using R2's patented technology in their chips without attribution or compensation."

The head of R2 states that Intel is the only company that R2 has ever sued, which contradicts Intel's R2 accusation of being a patent troll.

"That is how these lawsuits emerged, and Intel is the only entity R2 has ever accused of violating its patents," Fisher stated. "It is unsurprising but disappointing that Intel continues to peddle its false narratives rather than taking responsibility for its repeated and chronic infringement of our patents."

Patriot has formally introduced its first solid-state drives featuring a PCIe 5.0 x4 interface aimed at demanding users. The Viper PV553 SSD uses the company's all-new active cooling system boasting an aluminum radiator, a blower fan, and a special heat shield that promises to ensure the best possible cooling for consistent performance under high workloads.

Set to be available in 1 TB, 2 TB, and 4 TB configurations, Patriot's Viper PV553 uses Micron's 232-layer 3D TLC NAND memory and we presume Phison's PS5026-E26 controller as Patriot is a loyal partner of the Taiwan-based SSD controller developer.

As for performance, Patriot rates its 2 TB and 4 TB PV553 for sequential read/write speeds of up to 12,400 MB/s and 11,800 MB/s as well as up to 1.4 million random 4K read and write IOPS. Meanwhile, the 1 TB model is slightly slower and offers read/write speeds of up to 11,700 MB/s and 9,500 MB/s as well as up to 1.3/1.4 million read/write IOPS.

The drives come in an M.2-2280 form-factor and are compatible with desktops that have sufficient space inside as Patriot's Viper PV553 SSDs are equipped with quite an extraordinary cooling system to take away 11W of thermal power that they can dissipate. The cooler (which features a 16.5 mm z-height) employs a rather big aluminum radiator that covers both the controller and memory chips, a blower fan, thermal pads on both sides of the drive, and an aluminum casing — which the company calls heat shield — that directs air produced by the fan through the radiator's fins to maximize cooling performance.

The extensive cooling is supposed to ensure that Patriot's Viper PV553 drives sustains performance even under severe workloads. In fact, Patriot says that the cooler ensures that the drive maintains temperature at about 45ºC in normal room temperature conditions.

Meanwhile, PV553 SSDs are not Patriot's fastest drives. Recently the company demonstrated its Viper PV573 SSDs that use Micron's B58R 3D TLC NAND with a 2400 MT/s data transfer rate and offer a sequential read and write speed of up to 14,000 MB/s and 12,000 MB/s, respectively. That drive will perhaps get more benefits from the new cooling system, but it will be available at a later date.

As it is always the case with Patriot's premium SSDs, the Viper PV553 drives are backed by a five-year warranty and are guaranteed to sustain 700, 1400, and 3000 terabytes to be written.

Today we're looking at a all-in-one closed loop cooler from a face that's new to AnandTech: Geometric Future. Founded in 2020, Geometric Future is a PC components manufacturer with a goal of setting themselves apart in the crowded PC marketplace by redefining modern aesthetics. Their approach to design emphasizes the application of geometric elements and minimalist philosophy, as reflected in their slogan, "Simplify". They regard themselves as a potential future backbone in China's design industry, starting with a small step in the IT sector.

For such a new company, Geometric Future has already made significant strides in the realm of PC power and cooling products. One of their most notable products – and what we're reviewing today – is the Eskimo Junior 36, an all-in-one CPU liquid cooler available in 240mm and 360mm sizes. This cooler is designed with a minimalist aesthetic in mind, featuring a simplistic CPU block and equipped with high-performance Squama 2503 fans. Geometric Future pitches the Eskimo Junior 36 as being engineered to provide an optimal balance of cooling efficiency and aesthetics, making it able to achieve excellent cooling capabilities while maintaining low noise levels.

But marketing claims aside, we shall see where it stands in today’s highly competitive market in this review.

Minisforum has formally announced its V3, one of the industry's first AMD Ryzen 7 8840U-based hybrid PCs that can serve as a tablet, a laptop, and an external display, which is why the company positions it as a '3-in-1' system. As the machine packs an eight-core CPU, it may offer the performance of some mid-range laptops. Meanwhile, despite being a 'tablet,' it has two USB4 ports and an SD card reader, a rare feature for this class of devices.

The Minisforum V3 is closer to a classic laptop than a tablet, but this happens often. The system features a 14-inch detachable multitouch display with a 2560×1600 resolution, a 500 nits brightness, a 165 Hz refresh rate (which will undoubtedly be appreciated by gamers), and a stylus support that measures 323.26×219×9.8 mm and weighs 946 grams without the keyboard. The device is made of die-cast magnesium alloy and packs all the common sensors and features for tablets, such as a 5MP rear and 2MP front camera, gyroscopes, and a fingerprint reader.

The Minisforum V3 is powered by AMD's Ryzen 7 8840U (8C/16T, 3.30 GHz – 5.10 GHz, up to 28W) with built-in Radeon 780M graphics (768 stream processors) and is mated to up to 32 GB of LPDDR5-6400 memory as well as an up to 2 TB M.2-2280 SSD with a PCIe interface. To ensure consistent performance under high loads, Minisforum squeezed a cooling system into the tablet with four copper tubes and two fans, a rare feature. 

When it comes to connectivity, the Minisforum V3 comes with a Wi-Fi 6E + Bluetooth 5.3 adapter, two USB4 ports, a V-Link connector (a USB-C that acts like a DisplayPort In), a UHS-II SD card reader, and a 3.5-mm jack for headsets. Thanks to the V-Link connector, Minisforum's V3 can act like a tablet and a laptop and as a display for another notebook.

Minisforum V3 comes with an integrated 50 Wh battery, which is more or less in line with what some other thin-and-light 14-inch laptops offer. To easily balance between a long battery life and maximum performance, V3 has three power profiles, including power-saving mode (15W), balanced mode (18W – 22W), and high-performance (28W). Meanwhile, Minisforum does not estimate the actual battery life of the device for now.

Minisforum is expected to announce the pricing of its V3 hybrid PC next month.

A recall on 12VHPWR angled adapters from CableMod has reached its next stage this week, with the publication of a warning document from the U.S. Consumer Product Safety Commission. Referencing the original recall for CableMods' V1.0 and V1.1 adapters, which kicked off back in December, the CPSC notice marks the first involvement of government regulators. And with that has come to light a bit more detail on just how big the recall is overall, along with an estimated failure rate for the adapters of a hair over 1%.

According to the CPSC notice, CableMod is recalling 25,300 adapters, which were sold between February, 2023, and December, 2023. Of those, at least 272 adapters failed, as per reports and repair claims made to CableMod. That puts the failure rate for the angled adapters at 1.07% – if not a bit higher due to the underreporting that can happen with self-reported statistics. All told, the manufacturer has received at least $74,500 in property damage claims in the United States, accounting for the failed adapters themselves, as well as the video card and anything else damaged in the process.

As part of the recall, CableMod has asked owners of its angled 12VHPWR adapters V1.0 and V1.1 to stop using them immediately, and to destroy them to prevent future use. Buyers can opt for a full refund of $40, or a $60 store credit.

It is noteworthy that, despite the teething issues with the initial design of the 12VHPWR connector – culminating with the PCI-SIG replacing it with the upgraded 12V-2x6 standard – the issue with the CableMod adapters is seemingly distinct from those larger design flaws. Specifically, CableMod's recall cites issues with the male portion of their adapters, which was not altered in the 12V-2x6 update. Compared to 12VHPWR, 12V-2x6 only alters female plugs (such as those found on video cards themselves), calling for shorter sensing pins and longer conductor terminals. Male plugs, on the other hand, remain unchanged, which is why existing PSU cables made for the 12VHPWR remain compatible (and normally safe) with 12V-2x6 video cards. Though as cable mating is a two-way dance, it's unlikely having to plug into inadequate 12VHPWR female connectors did CableMod any favors here.

Sources: Consumer Product Safety Commission, HotHardware, CableMod

The global semiconductor industry saw its sales dropped around $47 billion to nearly $527 billion in 2023, according to estimations by the Semiconductor Industry Association (SIA). This was a sharp downturn from the record 2022, but good news is that sales picked up significantly in the second half of the year, showing signs of a strong recovery and positive expectations for the future.

"Global semiconductor sales were sluggish early in 2023 but rebounded strongly during the second half of the year, and double-digit market growth is projected for 2024," said John Neuffer, SIA president and CEO. "With chips playing a larger and more important role in countless products the world depends on, the long-term outlook for the semiconductor market is extremely strong."

As far as sales of chips across different parts of the world are concerned, Europe was the only region that saw an increase in sales, growing by 4%. Other regions did not perform this well: sales of chips in the Americas declined by 5.2%, Japan declined by 3.1%, and China experienced the biggest drop at 14%, according to the SIA.

"Advancing government policies that invest in R&D, strengthen the semiconductor workforce, and reduce barriers to trade will help the industry continue to grow and innovate for many years to come," Neuffer said.

Graphs generated by DALL-E/OpenAI based on data from the SIA

With its highly successful A100 and H100 processors for artificial intelligence (AI) and high-performance computing (HPC) applications, NVIDIA dominates AI datacenter deployments these days. But among large cloud service providers as well as emerging devices like software defined vehicles (SDVs) there is a global trend towards custom silicon. And, according to a report from Reuters, NVIDIA is putting together a new business unit to take on the custom chip market.

The new business unit will reportedly be led by vice president Dina McKinney, who has a wealth of experience from working at AMD, Marvell, and Qualcomm. The new division aims to address a wide range of sectors including automotive, gaming consoles, data centers, telecom, and others that could benefit from tailored silicon solutions. Although NVIDIA has not officially acknowledged the creation of this division, McKinney’s LinkedIn profile as VP of Silicon Engineering reveals her involvement in developing silicon for 'cloud, 5G, gaming, and automotive,' hinting at the broad scope of her alleged business division.

Nine unofficial sources across the industry confirmed to Reuters the existence of the division, but NVIDIA has remained tight-lipped, only discussing its 2022 announcement regarding implementation of its networking technologies into third-party solutions. According to Reuters, NVIDIA has initiated discussions with leading tech companies, including Amazon, Meta, Microsoft, Google, and OpenAI, to investigate the potential for developing custom chips. This hints that NVIDIA intends to extend its offerings beyond the conventional off-the-shelf datacenter and gaming products, embracing the growing trend towards customized silicon solutions.

While using NVIDIA's A100 and H100 processors for AI and high-performance computing (HPC) instances, major cloud service providers (CSPs) like Amazon Web Services, Google, and Microsoft are also advancing their custom processors to meet specific AI and general computing needs. This strategy enables them to cut costs as well as tailor capabilities and power consumption of their hardware to their particular needs. As a result, while NVIDIA's AI and HPC GPUs remain indispensable for many applications, an increasing portion of workloads now run on custom-designed silicon, which means lost business opportunities for NVIDIA. This shift towards bespoke silicon solutions is widespread and the market is expanding quickly. Essentially, instead of fighting custom silicon trend, NVIDIA wants to join it.

Meanwhile, analysts are painting the possibility of an even bigger picture. Well-known GPU industry observer Jon Peddie Research notes that they believe that NVIDIA may be interested in addressing not only CSPs with datacenter offerings, but also consumer market due to huge volumes.

"NVIDIA made their loyal fan base in the consumer market which enabled them to establish the brand and develop ever more powerful processors that could then be used as compute accelerators," said JPR's president Jon Peddie. "But the company has made its fortune in the deep-pocked datacenter market where mission-critical projects see the cost of silicon as trivial to the overall objective. The consumer side gives NVIDIA the economy of scale so they can apply enormous resources to developing chips and the software infrastructure around those chips. It is not just CUDA, but a vast library of software tools and libraries."

Back in mid-2010s NVIDIA tried to address smartphones and tablets with its Tegra SoCs, but without much success. However, the company managed to secure a spot in supplying the application processor for the highly-successful Nintendo Switch console, and certainly would like expand this business. The consumer business allows NVIDIA to design a chip and then sell it to one client for many years without changing its design, amortizing the high costs of development over many millions of chips.

"NVIDIA is of course interested in expanding its footprint in consoles – right now they are supplying the biggest selling console supplier, and are calling on Microsoft and Sony every week to try and get back in," Peddie said. "NVIDIA was in the first Xbox, and in PlayStation 3. But AMD has a cost-performance advantage with their APUs, which NVIDIA hopes to match with Grace. And since Windows runs on Arm, NVIDIA has a shot at Microsoft. Sony's custom OS would not be much of a challenge for NVIDIA."

For established PC peripheral vendors, the biggest challenge in participating in the highly commoditized market is setting themselves apart from their numerous competitors. As designs for coolers and other peripherals have converged over the years into a handful of basic, highly-optimized designs, developing novel hardware for what is essentially a "solved" physics problem becomes harder and harder. So often then, we see vendors focus on adding non-core features to their hardware, such as RGB lighting and other aesthetics. But every now and then, we see a vendor go a little farther off of the beaten path with the physical design of their coolers.

Underscoring this point – and the subject of today's review – is Enermax's latest all-in-one (AIO) CPU cooler, the LiqMaxFlo 360mm. Designed to compete in the top-tier segment of the cooling market, Enermax has opted to play with the physics of their 360mm cooler a bit by making it 38mm thick, about 40% thicker than the industry average of 27mm. And while Enermax is hardly the first vendor to release a thick AIO cooler, they are in much more limited company here due to the design and compatibility trade-offs that come with using a thicker cooler – trade-offs that most other vendors opt to avoid.

The net result is that the LiqMaxFlo 360mm gets to immediately start off as differentiated from so many of the other 360mm coolers on the market, employing a design that can give Enermax an edge in cooling performance, at least so long as the cooler fits in a system. Otherwise, not resting on just building a bigger cooler, Enermax has also equipped the LiqMaxFlo 360mm with customizable RGB lighting, allowing it to also cater to the aesthetic preferences of modern advanced PC builders. All together, there's a little something for everyone with the LiqMaxFlo 360mm – and a lot of radiator to cram into a case. So let's get started.

ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only a single extreme ultraviolet (EUV) system with a 0.55 numerical aperture lens may not seem like too impressive, but the company aims to ship a much larger number of such devices this year, and further production increases in the coming years.

ASML did not disclose how many High-NA EUV litho tools it plans to ship this year, but the company has already announced that it had obtained orders for these machines from all leading makers of logic chips (Intel, Samsung Foundry, TSMC) and memory (Micron, Samsung, SK Hynix), and that the total number currently stands between 10 and 20 systems. Essentially, this means that High-NA EUV will be widely used. But the question is when.

ASML's High-NA EUV Twinscan EXE lithography systems are the company's next-generation flagship production tools that will enable chipmakers to decrease critical dimensions of chips to 8nm in a single exposure, a substantial improvement over 13nm offered by today's Low-NA EUV Twinscan NXE. But that improvement comes at a cost. Each Twinscan EXE costs €350 million ($380 million), which is over two times more than the price of a Twinscan NXE (€170 million, $183 million).

The steep price tag of the new tools has led to debates on its immediate economic feasibility as it is still possible to print 8nm features using Low-NA tools, albeit using double patterning, which is a more expensive and yield-impacting technique. For example, Intel is expected to insert High-NA EUV lithography into its production flow for its post-18A fabrication process (1.8 nm-class) sometimes in 2026 – 2027, whereas analysts from China Renaissance believe that TSMC only intends to start using these tools for its 1 nm-class production node sometime in 2030. Other industry analysts, like Jeff Koch from Semianalysis, also believe that the broader adoption of these high-cost machines might not occur until it becomes economically sensible, anticipated around 2030-2031.

Nevertheless, ASML executives, including chief executive Peter Wennink, argue that elimination of double patterning by High-NA EUV machines will provide enough advantages — such as process simplification and potentially shorter production cycle — to deploy them sooner than analysts predict, around 2026-2027.

Having secured between 10 and 20 orders for the High NA EUV machines, ASML is preparing to increase its production capacity to meet the demand for 20 units annually by 2028. That said, the uncertainties around other chipmakers' plans to use High-NA tools in the next two or three years raises concerns about potential overcapacity in the near term as ASML ramps up production.

Sources: Bloomberg, Reuters