"Billionaire Elon Musk has announced plans to build a $20 billion chip plant in Austin, Texas" reports a local news station: Musk announced on Saturday night during a livestream on his social media platform X that the plant, called "Terafab," will be built near Tesla's campus and gigafactory in eastern Travis County. The long-anticipated project is a joint venture between Musk-owned properties Tesla, SpaceX and xAI... The Terafab plant is expected to begin production in 2027. Musk "has said the semiconductor industry is moving too slow to keep up with the supply of chips he expects to need," writes Bloomberg — quoting Musk as saying "We either build the Terafab or we don't have the chips, and we need the chips, so we build the Terafab." Musk detailed some specific plans, including producing chips that can support 100 to 200 gigawatts a year of computing power on Earth, and chips that can support a terawatt in space, but gave no timelines for the facility or its output... The facility is expected to make two types of chips, one of which will be optimized for edge and inference, primarily for his vehicle, robotaxi and Optimus humanoid robots. The other will be a high-power chip, designed for space that could be used by SpaceX and xAI... Musk said he expects xAI to use the vast majority of the chips. During the presentation, Musk also unveiled a speculative rendering of a future "mini" AI data center satellite, one piece of a much larger satellite system that he wants SpaceX to build to do complex computing in space. In January, SpaceX requested a license from the Federal Communications Commission to launch one million data center satellites into orbit around Earth. Musk said that the mini satellite he revealed would have the capacity for 100 kilowatts of power. "We expect future satellites to probably go to the megawatt range," Musk said. Raising money to build and launch AI data centers in space is one of the driving forces behind SpaceX's planned IPO later this year. SpaceX is expected to raise as much as $50 billion in a record-setting IPO this summer which could value it at more than $1.75 trillion, Bloomberg News reported earlier.

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Slashdot reader SysEngineer does embedded/IoT work, but "I want to pick a single system-on-a-chip architecture family and commit to it across multiple product lines — sensor nodes up through edge gateways... I've been on one platform for years and want to know what embedded engineers are actually running in production before I commit!" And "the family needs to scale — cheap and small at the low end, capable of running Linux on the bigger variants!" Their requirements? WiFi + BLE required LoRaWAN a nice-to-have. Low power modes that actually work in the field, not just on the datasheet. Full peripheral set — SPI, I2C, UART, ADC, timers, CAN. A toolchain and runtime support, support multi threads... Slashdot reader Gravis Zero is skeptical all the requirements can be met. "If you want embedded, you get embedded. If you want to run a big OS, you get one that will run a big OS." But Slashdot reader SysEngineer believes "The obvious architecture candidates are ARM, STM, and RISC-V" — and specifically they want to hear your experiences with the RISC-V choices. "What would you standardize on today if you were starting fresh? And how does real-world toolchain and community support hold up compared to the marketing?" Share your own thoughts and experiences in the comments. What's the best all-purpose RISC-V system on a chip family?

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An anonymous reader quotes a report from Reuters: Researchers at ASML Holding say they have found a way to boost the power of the light source in a key chip making machine to turn out up to 50% more chips by decade's end, to help retain the Dutch company's edge over emerging U.S. and Chinese rivals. ASML is the world's only maker of commercial extreme ultraviolet lithography (EUV) machines, a critical tool for chipmakers such as TSMC, Intel and others in producing advanced computing chips. "It's not a parlor trick or something like this, where we demonstrate for a very short time that it can work," Michael Purvis, ASML's lead technologist for its EUV source light, said in an interview. "It's a system that can produce 1,000 watts under all the same requirements that you could see at a customer," he added, speaking at the company's California facilities near San Diego. [...] With the technological advance revealed on Monday, which is being reported here for the first time, ASML aims to outdistance any would-be rivals by improving the most technologically challenging aspect of the machines. This is the quest to generate EUV light with the right power and properties to turn out chips at high volume. The company's researchers have found a way to boost the power of the EUV light source to 1,000 watts from 600 watts now. The chief advantage is that greater power translates into the ability to make more chips every hour, helping to lower the cost of each. Chips are printed similar to a photograph, where the EUV light is shone on a silicon wafer coated with special chemicals called a photoresist. With a more powerful EUV light source, chip factories need shorter exposure times. "We'd like to make sure that our customers can keep on using EUV at a much lower cost," Teun van Gogh, executive vice president for the NXE line of EUV machines at ASML, told Reuters. Van Gogh said customers should be able to process about 330 silicon wafers an hour on each machine by the end of the decade, up from 220 now. Depending on the size of a chip, each wafer can hold anywhere from scores to thousands of the devices. ASML got the power boost by doubling down on an approach that already places its machines among the most complex inventions of humans. To produce light with a wavelength of 13.5 nanometers, ASML's machine shoots a stream of molten droplets of tin through a chamber, where a massive carbon dioxide laser heats them into plasma. This is a superheated state of matter in which the tin droplets become hotter than the sun and emit EUV light, to be collected by precision optic equipment supplied by Germany's Carl Zeiss AG and fed into the machine to print chips. The key advancements in Monday's disclosure involved doubling the number of tin drops to about 100,000 every second, and shaping them into plasma using two smaller laser bursts, as opposed to today's machines that use a single shaping burst. [...] ASML believes the techniques it used to hit 1,000 watts will unlock continued advances in the future, Purvis said, adding, "We see a reasonably clear path toward 1,500 watts, and no fundamental reason why we couldn't get to 2,000 watts."

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