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Hier — 15 juin 2021AnandTech

SPEC Updates SERT Suite for ISO-Compliant Server Energy Efficiency Benchmarking

15 juin 2021 à 10:00
Par : Ganesh T S

The Standard Performance Evaluation Corporation's SPEC SERT Suite has evolved as the industry-standard for measuring the energy efficiency of servers over the last decade. Regulatory authorities such as the U.S EPA and Japan's METI are some of the many who have adopted the suite to determine thresholds for various energy-efficiency programs.

In August 2020, the International Organization for Standardization (ISO) published the ISO/IEC 21836:2020 standard to specify the measurement methodology for assessment and reporting of a server's energy efficiency. Today, SPEC is announcing SERT Suite 2.0.4, an update to enable its incorporation into the ISO standard. It must be noted that the SERT suite was already compliant with ISO 21836. The new version also brings in ISO compliance report links. In addition to including latest PTDaemon software (v1.9.2) that interfaces with SPEC-approved power analyzers and temperature sensors, and GUI optimizations, the SPEC SERT Suite 2.0.4 also supports servers based on the latest ARM processors from Ampere, Fujitsu, and Marvell.

The SERT 2.0.4 suite is priced at USD 2800, and is available for immediate download. Being a minor version update, it is free for SERT 2 licensees to upgrade. Similar to all other benchmarks developed by SPEC, the SERT Suite from the SPECpower Committee has been developed in a vendor-agnostic manner with representatives from across the industry. Needless to say, this greatly increases the credibility of the benchmark. The SERT Suite allows consumers / cloud service providers to determine the energy efficiency (and, the TCO indirectly) of a particular offering for their workloads. The latest offering keeps up with the evolving industry requirements.

Razer Announces Ultra-Compact "Razer GaN" 130W USB Type-C Charger

15 juin 2021 à 02:15

Alongside their new AMD-powered Blade 14 laptop, Razer today also used E3 2021 to announce a new, high-powered USB-C charger. The Razer GaN USB Type-C charger is a compact charging solution that is pocket-sized and can deliver up to 130 W of combined charging power across its two USB-C and two USB-A outputs.

If you've ever owned one of the latest smartphones or Bluetooth 5.1 devices, it's likely to come with a USB Type-C charging port. The Type-C connector has become more popular as more and more powered devices come with Type-C. With the USB-IF announcing its specifications for the new USB-PD standard with support for up to 240 W, power supply engineers are increasingly using Gallium Nitride (GaN) semiconductors for more efficient and compact designs.

GaN by name and GaN by nature, the Razer GaN is powered by using Gallium Nitride, which has allowed Razer to cut down on the size of the charger. Razer claims that their GaN charger is small enough to fit inside a pocket, measuring 62 x 32 x 76 mm (D x W x H) in size and weighing in at 349 g. Looking at the aesthetics, the GaN includes a black plastic chassis with Razer's trademark green accent color being used in the USB Type-A ports as well as the power indicator light. And in case you're still not sure who made it, there's a Razer logo embossed onto the side as well.

The Razer GaN has a foldable fork for plugging directly into a plug socket and comes supplied with global power adapters. Users can charge devices in regions such as North America, Europe, the UK, and Asia. Also included in the accessories is a 2 meter USB cable, although Razer didn't specify Type-C or Type-A.

In terms of charging ports, the Razer GaN has two Type-C outputs and two Type-A outputs. Each pair of outputs are on a shared power plane, allowing the charger to power several devices at once, though at a reduced rate if used with multiple high-powered devices. This works out to the two Type-C ports sharing 100 W of capacity, while the two Type-A ports share another 18 W. And since this is a universal power supply, the Razer GaN can charge everything from phone and tablets to Razer Blade laptops, Apple MacBooks, as well as smartwatches and Windows laptops that support Type-C charging. 

Razer GaN Charger
  Max Port Power Max Group Power Max Charger Power
USB-C #1 100W 100W 130W
USB-C #2 100W
USB-A #1 18W 18W
USB-A #2 18W

The Razer GaN USB Type-C 130 W charger can be pre-ordered at the Razer Store from the 14th of June, with shipping of stock expected within 30 days of the date. Though don't mistake the diminutive size of the charger for a diminutive price tag; the charger carries an MSRP of $180.

Razer Unleashes Blade 14 Gaming Laptop: Ryzen 5000 Mobile with GeForce Graphics

15 juin 2021 à 00:30

During their E3 2021 gaming event this afternoon, Razer has launched the latest variant of its popular Blade 14 gaming laptop. For the first time, Razer is using an AMD processor to power its latest Blade 14 thin gaming laptop. Marking a milestone within the company, the Razer Blade includes plenty of features, including Wi-Fi 6E, dual USB 3.2 G2 Type-C, and multiple options with NVIDIA's GeForce RTX graphics for fine-tuning the laptop's portable gaming performance.

Back in 2011, when Razer first entered the gaming laptop market, the competition between Intel and AMD in the desktop and mobile space wasn't like it is now. Since then, a lot has changed with the emergence of AMD's Ryzen architecture, and at present, it is doing very well. With Ryzen Mobile offering powerful performance and in January, it launched its Ryzen 5000 Mobile parts at CES 2021.

With Razer commanding a niche market in the laptop space with all of its models designed for gaming, the latest Razer Blade 14 comes equipped with AMD's Ryzen 9 5900HX processor, with eight cores, sixteen threads, a maximum boost clock speed of 4.6 GHz, and is unlocked allowing users to apply overclocks. While the Blade 14 isn't an 'AMD Advantage' system benefiting from both AMD processor and graphics, it marks a big step for a brand typically associated specifically with Intel chips. 

The AMD Ryzen powered Razer Blade 14 comes with two choices in regards to panel type. This includes the option of a 1080p 144 Hz 100% sRGB display, or a more premium 1440p 165 Hz 100% DCI-P3 display. Both panels are IPS-based and come with variable refresh rate support. For storage, the Razer Blade 14 includes a 1 TB PCIe 3.0 x4 NVMe SSD, while memory comes in the form of 16 GB of DDR4-3200. Unfortunately for buyers looking at later-life upgrades, the memory is fixed onto the motherboard, so 16 GB is all it ever will have.

Buyers can select between three NVIDIA options in terms of graphics. This includes a GeForce RTX 3060 mobile GPU with 6 GB of VRAM, an RTX 3070 with 8 GB of VRAM, or an RTX 3080 also with 8 GB of VRAM. All three models have their GPUs set to 100 W TGP (total graphics power). Keeping the components cool is a vapor chamber cooling solution, and Razer is advertising up to 12-hours battery life and comes with a compact 230 W power adapter.

Razer is also touting the Blade 14 as the world's thinnest gaming laptop, and the dimensions make it rather sleek indeed. It's 16.8 mm thick, with a 220 mm x 319.7 mm footprint. Although Razer didn't provide us with details on the weight, the frame itself is custom CNC milled from a single block of T6 grade aluminum, commonly used for aircraft parts, and comes with a matte black anodized finish. Other design aspects include per-RGB backlit keys powered by Razer Chroma and features an N-Key rollover keyboard. The keys themselves have a 1 mm actuation, and keys can be programmed via Razer Synapse 3. Also included is a large glass precision trackpad, which is Windows Precision-capable and adapts to usage and can respond to multiple finger gestures. 

I/O connectivity include two USB 3.2 G2 Type-C ports with DP alt-mode and 100 W charging capabilities, two USB 3.2 G2 Type-A ports, one HDMI 2.1 video output, and a single 3.5 mm combo audio port. Along the top of the bezel is a Windows Hello 720p webcam and comes with THX-certified Spatial Audio with two premium speakers. The Blade 14 also comes with a Kensington lock for security on the go.

The AMD Ryzen 5900HX powered Razer Blade 14 will start shipping from June 14th, with prices starting at $1799.

Related Reading

À partir d’avant-hierAnandTech

Sponsored Post: Keep Your App’s Memory Safe with Arm Memory Tagging Extension (MTE)

14 juin 2021 à 18:30

Subtle memory bugs, including buffer overruns and pointer errors, create ticking time bombs inside your applications. Malicious actors can exploit these bugs to execute unauthorized code, take over systems to add them to malware botnets, or simply cause applications and systems to crash. The notorious Morris Worm of 1988 was one of the earliest examples of a malicious application exploiting a buffer overflow. Announcements of memory safety issues creating potential exploits arrive with alarming frequency, either from security researchers or found loose in the wild.

The impact on users can be substantial. Rogue applications can take advantage of unsafe memory in order to gain access to sniff out sensitive data, such as user credentials and passwords, enabling access to higher levels of privilege in the system. This allows bad actors to gain access to confidential data or make the system part of a larger botnet. It’s not always outside forces that cause problems – sometimes unsafe memory results in unpredictable system crashes due to memory leaks and related issues, frustrating users. It’s estimated that two-thirds of all Android vulnerabilities happen due to unsafe memory practices.

Arm Memory Tagging Extension

Software-based solutions, including Address Sanitizer (Asan), help mitigate these memory issues by integrating memory corruption detection into modern compilers. However, Asan requires adding software instrumentation to application code, which can significantly slow down app runtime and increase memory usage, particularly problematic in mobile and embedded systems.

What’s needed is a solution to detect and minimize memory bugs with minimal impact on performance and memory use. Properly implementing a hardware-based method for detecting potentially unsafe memory usage results in smaller memory usage and better performance, while improving system reliability and security.

Arm introduced its memory tagging extension as a part of the Armv8.5 instruction set. MTE is now built into Armv9 compliant CPUs recently announced by Arm, such as the Cortex-X2, Cortex-A710, and Cortex-A510. Future CPUs based on Armv9 will also integrate MTE. These all include memory tagging as a basic part of the architecture.

Seagate Signs HAMR Deal with Showa Denko: Secures Second Source for HAMR Platters

11 juin 2021 à 17:00

Seagate this week signed an agreement with Showa Denko in a bid to secure a second source of platters for its hard drives based on heat assisted magnetic recording (HAMR) technology. Under the terms of the deal, Seagate will evaluate SDK's existing materials for HAMR media and the two companies will jointly develop future materials. 

Seagate started to ship its Exos HDDs featuring HAMR inside its Lyve storage systems late last year. These hard drives use key components, such as recording heads with a near field transducer that heats up the media as well as glass platters with an FePt magnetic layer, developed and made entirely in-house. Being a vertically integrated company, Seagate has enough production capacities to continue building platters for HAMR drives internally, but having a second source for a crucially important component makes a lot of sense for high-volume products. 

Having spent over 10 years on HAMR pathfinding and research, Showa Denko formally began to develop its glass platters for HAMR HDDs in February, 2020. Back then, the company said that HAMR would achieve areal density of 5-6 Tb/in2 in the future, enabling 3.5-inch hard drives with eight or nine platters to store 70 TB – 80 TB of data. 

By now, Showa Denko has finished development of its first HAMR media material featuring a FePt magnetic alloy and technology to mass-produce hard drive platters. Under the terms of the agreement between SDK and Seagate, the hard drive maker will evaluate the material designed by the Japanese company. Going forward, Seagate and SDK will jointly develop new magnetic alloys for HAMR HDDs.

For now, Seagate will continue using its own FePt glass media inside its HAMR HDDs, but if it finds Showa Denko's HAMR media good enough, it might use it for future hard drives.

The contract between Seagate and Showa Denko ensures that the hard drive maker will have two sources of HAMR platters in the future, which will be important if Seagate significantly expands usage of its HAMR technology. In fact, once HAMR media hits certain areal density (i.e., significantly higher than PMR's 1.14 Tb/inch2), it will make a great sense to adopt the technology nor only for highest-capacity HDDs, but also for midrange HDDs to cut down their costs.

"[HAMR] is not only about the highest capacity point," said David Mosley, CEO of Seagate, at a conference last year. "If we can save a disk and two heads in a 16 TB drive, we will look at doing that as well. So, it is really across the whole portfolio, which is why we think that this platform play is so important. We can introduce HAMR into the same platform. The cost increases are really nominal."

Furthermore, Seagate will also ensure that SDK-made HAMR platters will be compatible with its HAMR implementation, which might become the company's competitive advantage against Toshiba and Western Digital once they adopt this technology.

"We expect this alliance will further accelerate technological development pioneered by the two companies," a statement by Showa Denko reads.

For Showa Denko, the world's largest independent maker of HDD platters, it is important to maintain close relationship with all makers of hard drives. Nowadays the bulk of SDK's shipments are platters designed for PMR and SMR HDDs, but it is also ramping up production of media for Toshiba's MAMR-based drives. The pact with Seagate ensures that Showa Denko will also be a part of upcoming HAMR HDDs.

Related Reading:

Source: Showa Denko

Best CPUs for Workstations: June 2021

10 juin 2021 à 18:15

Sometimes choosing a CPU is hard. So we've got you covered. In our CPU Guides, we give you our pick of some of the best processors available, supplying data from our reviews. Our Best CPUs for Workstations guide mostly covers workstation processors available to consumers, although some server products cover both segments.

It’s been a while since we updated this guide, perhaps because the world of the workstation processor you can buy on the shelf hasn’t really changed all that much. While AMD is releasing new hardware, and differentiating between the high-end desktop with Threadripper and workstation with Threadripper Pro, Intel by contrast released its latest retail HEDT/WS processors back in November 2019, and hasn’t been in a position to update them since. Beyond, all signs coming out of Intel on their HEDT/WS retail platform indicate that it is a market they do not have the products for. Instead Intel is focusing on its more enterprise Xeon WS solutions, which only really come as part of a pre-built system.

Nonetheless the impact of the semiconductor shortage is affecting what people can buy. Some processors are fluctuating in and out of stock, and given that HEDT/WS processors give the most margin, there is some impetus from the manufacturers to provide sufficient stock where the demand is. Earlier this year AMD launched its Zen 2-based Threadripper Pro platform, providing the equivalent of an effective EPYC processor for single socket workstations only, but at higher frequencies. These processors have proven to be interesting, and we’re hands deep in our testing for review right now.

Xilinx Expands Versal AI to the Edge: Helping Solve the Silicon Shortage

9 juin 2021 à 15:00

Today Xilinx is announcing an expansion to its Versal family, focused specifically on low power and edge devices. Xilinx Versal is the productization of a combination of many different processor technologies: programmable logic gates (FPGAs), Arm cores, fast memory, AI engines, programmable DSPs, hardened memory controllers, and IO – the benefits of all these technologies means that Versal can scale from the high end Premium (launched in 2020), and now down to edge-class devices, all built on TSMC’s 7nm processes. Xilinx’s new Versal AI Edge processors start at 6 W, all the way up to 75 W.

An AnandTech Interview with TSMC: Dr. Kevin Zhang and Dr. Maria Marced

8 juin 2021 à 18:15

In the past week, TSMC ran its 2021 Technology Symposium, covering its latest developments in process node technology designed to improve the performance, costs, and capabilities for its customers. In this event, TSMC discussed its increasing use of Extreme Ultra Violet (EUV) lithography for manufacturing, enabling it to scale down to its 3nm process node, well beyond that of its competitors. TSMC also addressed the current issues surrounding demand for semiconductors, along with announcing that it is building new facilities for advanced packaging production. Joining CEO Dr. CC Wei as part of the keynote presentation was AMD’s CEO Dr. Lisa Su, Qualcomm’s President (and soon to be CEO) Cristiano Amon, and Ambiq’s Founder and CTO Scott Hanson.

As part of the proceedings, TSMC offered AnandTech a 30-minute interview with Dr. Kevin Zhang, SVP of Business Development, and Dr. Maria Marced, President of TSMC EU, as an opportunity to learn more about TSMC’s driving directions as well as cooperation with industry partners.

Computex 2021: G.Skill Trident Z Royal Elite With DDR4-4000 CL14, Tight Latencies

8 juin 2021 à 14:00

During Computex 2021, G.Skill has announced a couple of new memory kits featuring its regal-looking Trident Z Royal Elite heatsinks. Available with super tight primary latencies of CL14, the new Trident Z Royal Elite kits will be available in DDR4-4000 and DDR4-3600, with various capacities available, including 16, 32, 64, and 128 GB kits.

There are many different parts of a system that can add varying levels of aesthetic glamor, including the motherboard, CPU cooler, fans, anything with RGB on it, but almost everything struggles to be as bling as G.Skills Trident Z Royal Elite memory. Launched back in April, the G.Skill Trident Z Royal Elite comes available in gold and silver. Both color variants feature eight customizable RGB LED lighting zones, with a patented crystalline patterning across for that regal touch.

Touching on the specifications, the top kit features speeds of DDR4-4000 with CL14-14-14-35, at a larger-than-expected operating voltage of 1.55 V. It will be available in two varieties, including a 16 GB (2 x 8 GB), and a 32 GB (2 x 16 GB) kit. The DDR4-3600 kits come with equally tight CL14 latencies, with a slightly lower 1.45 V operating voltage, and will be available in 16 GB (2 x 8 GB), 32 GB with the option for 2 x 16 GB or 4 x 8 GB kits. For users looking for more capacity, there are options at 64 GB with 4 x 16 GB and a large 128 GB kit with 8 x 16 GB. 

G.Skill says the new Trident Z Royal Elite DDR4-4000 and DDR4-3600 CL14 kits will be available from June but haven't provided us with pricing at the time of writing.

Apple Announces iOS 15 and iPadOS 15: The Highlights

7 juin 2021 à 22:30

Today at Apple’s 2021 WWDC event, the company unveiled the new iOS 15, iPadOS 15 operating systems. This year, Apple presented a large number of new features and improvements across both the main OS components as well as Apple’s core ecosystem apps. While we are just scratching the surface, we picked out a few highlight features that are looking forward to test later in the year once the new versions will be hitting consumers in their final versions.

Computex 2021: TeamGroup Announces its First DDR5-4800 Memory Module

7 juin 2021 à 20:00

Back in December 2020, TeamGroup announced its intentions for the switch to DDR5 memory on future platforms. During Computex 2021, TeamGroup claims it has 'successfully taken the lead over competing PCB manufacturers', with the first of its announced products for DDR5, the Elite DDR5-4800 16 GB module. Back at CES 2021, ADATA claimed that it has a DDR5 module in hand, but it sent us rendered images. We ultimately disapprove of this practice - don't state you have it in hand until you are ready to provide us actaul photographs of the thing. Unfortunately, TeamGroup has done the same here, providing renders. not photographs.

The Road to DDR5

Over the last year, we've highlighted certain aspects of DDR5 memory and what users can expect, including features, memory latency, and technological advancements over the current DDR4 memory. Some of which can be seen below:

TeamGroup's announcement hasn't come as a surprise given how long DDR5 has been speculated and discussed over the last year. One of the first platforms to supposedly feature DDR5 support is Intel's Alder Lake microarchitecture, which is expected to land in Q4 2021/Q1 2022. The first series of DDR5 from TeamGroup will be based on its 'Elite' memory series, with the first kit to feature speeds of 4800 MT/s, sub-timings of CL40-40-40-77, and will feature an operating voltage of 1.1 V.

One of the primary features of DDR5 is integrated on-die ECC, which is designed to improve overall system stability (but is actually more to do with yield). This is different to module-wide ECC, which DDR5 does not support by default (you still need a module-wide ECC module to support ECC technology). The information provided by TeamGroup say the Elite DDR5-4800 has double the banks compared to DDR4, with an all-black PCB. It is unclear whether or not the Elite DDR5-4800 will feature heatsinks, or they will operate with a bare PCB. We also know that it will feature 16 GB of capacity and will likely be sold as a dual-channel kit, and perhaps individually.

At present, there's no information on latency timings or how much the Elite DDR5-4800 16 GB module will cost, but TeamGroup does state that it will be unveiling its 'new generation' of products in September 2021.

NZXT Announces N7 Z590 Motherboard For Rocket Lake

7 juin 2021 à 17:00

In July last year, we reviewed NZXT's N7 Z490 motherboard for Intel's 10th generation Comet Lake processors. Typically later to the market than other vendor's key models, NZXT has announced its latest option which aims to benefit from the PCIe 4.0 support in Rocket Lake. Enter the N7 Z590. Some of the features include a full-cover panel across the PCIe slot area, Wi-Fi 6E, 2.5 GbE, dual M.2, support for DDR4-4600 memory, and is advertised with a 14-phase power delivery.

NZXT entered the motherboard market for the first time back in 2018 with the N7 Z370, which we also reviewed. Typically known more for its clean-cut chassis and cooling products, NZXT first tasked the job of providing the PCB and componentry to ECS for the Z370, and then switched to ASRock for Z490. It is unclear which vendor NZXT relies on for the N7 Z590, but we expect the relationship with ASRock is still intact, but we will confirm this when we know.

The N7 Z590 is similar to the previous model in terms of aesthetics, with models available in either matte black or white and uses a full cover PCIe slot armor and more armor covering the right-hand side of the board. Despite not including any integrated RGB LED lighting onboard, NZXT is using its CAM software to control the four RGB LED headers located on the board, with an integrated fan controller adding control of cooling with a total of seven 4-pin headers located on the board.

In terms of specification, the NZXT N7 Z590 has two full-length PCIe slots, one operating at PCIe 4.0 x16 and the other at PCIe 3.0 x4, with three PCIe 3.0 x1 slots. In the top right-hand corner is four memory slots, with support for DDR4-4600 and a total capacity of up to 128 GB. Storage capabilities include two M.2 slots, one featuring support for PCIe 4.0 x4 drives and the second slot supporting PCIe 3.0 x4 and SATA drives. There are four SATA ports for conventional storage and optical devices that also support RAID 0, 1, 5, and 10 arrays.

The rear panel has a much better selection of input and output than the N7 Z490, with one USB 3.2 G2x2 Type-C, three USB 3.2 G2 Type-A, four USB 3.2 G1 Type-A, and two USB 2.0 ports. A Realtek ALC1220 HD audio codec controls the five 3.5 mm audio jacks and S/PDIF optical output, while wireless capability comes from Intel's latest AX210 Wi-Fi 6E CNVi. Taking care of wired networking is a Realtek RTL8125BG 2.5 GbE controller, while also on the rear panel is an HDMI 2.0 video output and a small clear CMOS button.

The NZXT N7 Z590 is currently available on NZXT's website for $280.

Source: NZXT

Related Reading

Noctua NH-P1 Passive CPU Heatsink Spotted at Newegg for $100

7 juin 2021 à 16:00

Back at Computex 2019, when we visited Noctua at its booth, we saw a concept CPU heatsink, a monolith, with a passive design. In many circles including fans of silent and passively cooled systems, this is a highly anticipated announcement, and although there's nothing official from Noctua yet, the new NH-P1 has been spotted on a listing at Newegg by FanlessTech.

The Noctua NH-P1 features a completely fanless design, and although there's no official word on its TDP rating yet, we saw the concept cooler at Computex 2019 keeping an Intel Core i9-9900K cooled in a test system. The 9900K for reference has a PL1 rating of 95 W, and a PL2 rating of 210 W, so we know it has some serious cooling potential for a passive cooler.


The Noctua Concept Fanless CPU Cooler at Computex 2019

As with other Noctua CPU coolers, it includes its SecuFirm2+ mounting system which is compatible with Intel's LGA1200, LGA115x, and LGA1200xx sockets, and also allows support for AMD's AM4, AM3+, AM3, AM2, and FM2 sockets. The finer specifics of the design are currently unclear, but Noctua does supply a tube of its latest NT-H2 thermal paste with it, as well as a limited six-year warranty. Noctua doesn't recommend overclocking due to the limited cooling properties of a passive design, but it can also be used with Noctua's fans, with grooves that allow users to add fans with its retention brackets.

At the time of writing, Newegg has pulled the listing from its website, which means it could have jumped the gun, but we do expect the Noctua NH-P1 to be announced imminently. The Newegg listing had the Noctua NH-P1 at $100, which means it's not going to be cheap, but it targets a niche market.

Source: FanlessTech

Computex 2021: TeamGroup Goes BIG, the Xtreem DDR4-3600 256 GB Memory Kit

7 juin 2021 à 15:00

At the all-digital Computex 2021 trade show, TeamGroup has announced a new high-capacity memory kit designed for the high-end desktop market and workstation use. The new TeamGroup T-Force Xtreem ARGB DDR4-3600 kit boasts a combined capacity of 256 GB with 8 x 32 GB modules.

Whether it's ridiculous amounts of Google Chrome tabs or a more realistic use case such as video editing, the Xtreem ARGB DDR4-3600 256 GB kit aims to provide a premium solution for workstation users on compatible platforms such as AMD's Threadripper 3000 series or Intel's Cascade Lake-X. The memory itself has a rectangular mirror finish on its illuminated heatsinks, designed to produce a layered effect that TeamGroup says is 'dazzling.'

Regarding the specifications, the 256 GB kit has eight 32 GB sticks that operate at 3600 MT/s (DDR4-3600) and have primary latency timings of CL 18-22-22-42. There's no information available on the specific memory chips this kit is using, nor does TeamGroup specify the operating voltage of the kit. It has the speed to satisfy gaming demands, with AMD Threadripper using its Infinity Fabric interconnect in parallel with memory frequency.

At present, we don't know when the TeamGroup T-Force Xtreem ARGB 256 GB (8 x 32 GB) kit will hit retail shelves, nor do we have the pricing. One thing is for certain; it's not going to be cheap as a similar kit in the Xtreem ARGB series with 64 GB (2 x 32 GB) retails for $420 at Newegg.

The Apple WWDC 2021 Keynote Live Blog (Starts at 10am PT/17:00 UTC)

7 juin 2021 à 14:00
Par : Ryan Smith

As things slowly get back to normal, Apple's annual World Wide Developers Conference is taking virtual place this week in its traditional early-June slot. As always, Apple kicks off WWDC with their big keynote event, which though aimed first and foremost at developers, is also used as a venue to announce new products and ecosystem strategies. The keynote starts at 10am Pacific (17:00 UTC) today, and AnandTech will be offering live blog coverage of Apple's event.

A rapid-fire, two-hour run through Apple's ecosystem, WWDC keynotes cover everything from macOS and iOS to individual Apple applications and more. On the hardware side of matters, last year we saw the official announcement of Apple's shift from x86 processors to Arm processors for their venerable Mac lineup of computers, and while it's unlikely Apple is going to have anything to top that for WWDC21, the company is not even half-way through its transition to Arm SoCs. So this year's WWDC gives Apple ample opportunity to reflect on the Arm transition thus far, as well as what's coming next for the company's more powerful Macs.

So join us at 10am Pacific to see just what Apple is working on for this year and beyond.

After Selling HyperX to HP, Kingston Resurrects FURY Brand for DRAM and SSDs

7 juin 2021 à 13:00

Last week, we reported that the highly anticipated acquisition of Kingston's HyperX gaming brand by HP was completed for the sum of $325 million. As we noted, the terms of the deal did not include any of the HyperX branded DRAM, flash, or storage products, which is Kingston's bread and butter, as the deal focused more on the gaming accessory business as well as the brand value. We have now learned that Kingston is rebranding the DRAM and storage products it retains as the FURY series.

Although Kingston is planning a formal announcement of the brand on the 19th of July 2021, it shared details with us on some of its new key ranges. The FURY series isn't new to Kingston, as it debuted back in 2014 as one of its more affordable memory ranges designed for gamers on a budget. Kingston has rebranded its own series in preparation for a new start and marketing strategy for its consumer-focused DRAM and storage products.

From the new product lines, the Kingston FURY Renegade memory series will feature speeds of up to DDR4-5333 MT/s, with both RGB and non-RGB options available. The rebranded FURY Beast series will sit as the new entry-level in its gaming-centric DRAM products, with DDR3 and DDR4 products with speeds of up to 3733 MT/s. Its FURY Impact range offers competitive options for laptops, NUCs, and other types of small form factor systems, with DDR3 and DDR4-3200 SO-DIMMs. Kingston has yet to unveil any details about its impending FURY storage products at this time.

There's no word on availability or price at present, but we expect to find out more on the 19th of July 2021, when Kingston officially unveils its new FURY products to the public.

Source: Kingston

Computex 2021: ASRock Announces Mars 5000U Series Mini PC

4 juin 2021 à 17:00

During Computex 2021, ASRock unveiled the latest series in its Mars mini-PC range, the Mars 5000U. ASRock claims it's the thinnest AMD mini PC globally and comes equipped with AMD's latest 5000 series APU. It features support for DDR4-3200 SO-DIMM memory, one PCIe 3.0 x4 M.2 slot, a 2.5" SATA hard drive bay, and an Intel Wi-Fi 6 interface.

The ASRock Mars 5000U series comes in a svelte and very slimline black brushed aluminum chassis, with dimensions of 194 x 150 x 26 mm (W x D x H), making it a single mm thicker than a regular chassis fan. Due to there being very little wiggle room for space inside, at just 0.7 liters, ASRock uses a proprietary fan and heatsink combination to keep the AMD Ryzen 5000U APU cool. For memory, there's a pair of memory slots that can accommodate up to 64 GB of DDR4-3200 SO-DIMM memory, while storage capabilities include one PCIe 3.0 x4/SATA M.2 slot and one 2.5" SATA hard drive bay.

It is powered by a 65 W/19 V adaptor akin to a laptop charger and includes a decent selection of I/O. Included are four USB 3.2 G1 Type-A (two rear, two front), one USB 3.2 G1 Type-C (front), and two USB 2.0 (front) ports. The Mars 5000G also includes a 3-in-1 card reader including SD, SDHC, and SDXC support and two video outputs consisting of an HDMI and D-Sub. Networking options include one unspecified Gigabit Ethernet port with an Intel AX200 wireless interface offering Wi-Fi and BT 5.0 connectivity. An unspecified audio solution also powers a 3.5 mm microphone and 3.5 mm headphone jack combination.

The ASRock Mars 5000U series looks very similar to the previous Mars 4000 series mini-PC series. The only difference is that the newer model supports the upcoming Ryzen 5000 APUs based on AMD's Zen 3 microarchitecture. ASRock hasn't stated which APUs it will offer. Pricing is currently unknown.

Computex 2021: GIGABYTE Server Updates MZ72-HB0 For Dual Socket 3rd Gen EPYC

4 juin 2021 à 15:00

During Computex 2021 in Taipei, although the event is all-digital due to the Coronavirus pandemic, GIGABYTE Server has showcased its newly revised MZ72-HBO dual-socket motherboard with support for AMD's 3rd generation EPYC 7003 processors. The GIGABYTE Server MZ72-HBO boasts support for up to 128 cores and 256 threads (64c/128t per socket), dual 10 GbE Base-T Ethernet, up to 4 TB of DDR4-3200 memory, and five full-length PCIe 4.0 slots.

In the server workspace, the use case for high-core count processors includes data centers, cloud computing, and MPI parallel programming. This is where the GIGABYTE Server MZ72-HB0 comes in, with support for up to 280 W TDP chips. This means it can support a maximum of 128-cores and 256 threads of powerful Zen 3 EPYC 7003 goodness across both AMD SP3 sockets. Each of the SP3 sockets includes eight memory slots (sixteen in total), with support for up to 2 TB of DDR4-3200 memory per processor operating in eight-channel, with RDIMM, LRDIMM, and 3DS memory types all supported. 

The GIGABYTE Server MZ72-HB0 Revision 3.0 boasts a wide variety of features, including lots of storage, with one PCIe 4.0 x4 M.2 slot, four 7-pin SATA ports, and three SlimSAS ports offering support for either twelve SATA or three PCIe 4.0 U.2 NVMe drives. Included on the board is an ASPEED AST2500 BMC controller, which allows access to GIGABYTE's Management Console (GMC), and includes a Gigabit Management LAN port for remote access. Other networking capability includes a pair of 10 GbE Base-T LAN ports powered by a Broadcom BCM57416 controller. On the lower portion of the board are five full-length PCIe 4.0 slots that can operate at x16/x16/x16/x8/x8, while I/O on the rear panel includes two USB 3.0, a COM port, and a D-sub video output for the BMC.

At the time of writing, we are unsure when the GIGABYTE Server MZ72-HB0 will be available at retail, however the company has started channel distributions and we actually have a review unit in-house on our Milan test-bench. However, the previous MZ72-HB0 (revision 1.0) model with support for EPYC 7002 processors retails between $700 and $900 depending on the retailer. Due to this, we expect the newer revision 3.0 model to fall in a similar price bracket.

Source: GIGABYTE Server

Computex 2021: ASRock Unveils New X570S and B550 PG Riptide Motherboards

3 juin 2021 à 22:00

Back in July 2019, when AMD unveiled its X570 chipset for its Ryzen processors, it captivated enthusiasts and PC users as the first desktop chipset to feature PCIe 4.0. This brought many vendors wondering how to keep the chipset cool, and all but one (GIGABYTE X570 Aorus Xtreme) came with some form of active cooling. Fast forward to 2021 and the latest iteration of new models dubbed X570S does away with the chipset fan altogether. In lieu of this, ASRock has announced the new PG Riptide series with both an X570S and B550 model designed for gamers.

Starting with the more premium of the two, the ASRock X570S PG Riptide has dual PCIe 4.0 x4 M.2 (one with SATA support) and six SATA ports with support for RAID 0, 1, and 10 arrays. There are a total of three full-length PCIe 4.0 slots that can operate at x16/x0/+x4 and x8/x8/+4, with three PCIe 4.0 x1 slots sandwiched in between. Other connectivity includes a front panel USB 3.2 G2 Type-C header, two USB 3.2 G1 Type-A headers (four ports), and two USB 2.0 headers (four ports). 


The ASRock X570S PG Riptide motherboard

Aesthetics on both models are practically identical, with the X570S featuring a larger square chipset heatsink, with the chipset heatsink on the B550 resemblant of a shield. The ASRock B550 PG Riptide has three full-length PCIe slots, with the top slot operating at PCIe 4.0 x16 and the other two operating at PCIe 3.0 x4/x1, with three PCIe 3.0 x1 slots. Regarding storage, the B550 model has one PCIe 4.0 x4 M.2 slot, one PCIe 3.0 x4/SATA slot, and six SATA ports with support for RAID 0, 1, and 10 arrays.

The ASRock X570S PG Riptide supports DDR4-5000, while the B550 PG Riptide supports up to DDR4-4933 out of the box. Both have four memory slots with support for up to 128 GB of capacity. Both models are also advertised to feature a 10-phase power delivery with Dr. MOS power stages. Both models also come supplied with ASRock's patent-pending VGA holder.


ASRock PG Riptide X570S (top) and B550 (bottom) rear panels

The ASRock X570S PG Riptide has one USB 3.2 G2 Type-C, one USB 3.2 G2 Type-A, four USB 3.2 G1 Type-A, and two USB 2.0 ports on the rear panel. In contrast, the B550 PG Riptide includes the same but with two additional USB 3.2 G1 Type-A ports. Both rear panels include a Killer E3100G 2.5 GbE controller, with space through an M.2 Key-E slot for users to add a Wi-Fi module, while both also use a Realtek ALC897 HD audio codec which adds five 3.5 mm audio jacks and a S/PDIF optical output. There's one HDMI 2.1 video output and a PS/2 keyboard and mouse combo port on both models, while the X570S includes a small BIOS flashback button.

At the time of writing, ASRock hasn't said when the new PG Series X570S and B550 will be available or how much either board will cost.

Source: ASRock

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