Comme chez Intel, le premier trimestre d’AMD aussi a été marqué par du bon et du moins bon. En bref, la croissance a été plus que modeste et ce sont les segments "Data center" et "Client" qui ont (encore) sauvé les meubles. Certes, le constat ne sera pas tout à fait le même selon si l’on regarde l’...
As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that it remains on track to meeting its goal of starting mass production of chips on its SF3 (3 nm-class, 2nd Generation) technology in the second half of the year. Meanwhile in June, Samsung Foundry will formally unveil its SF2 (2 nm-class) process technology, which will offer a mix of performance and efficiency enhancements. Finally, the company the company is preparing a variation of its 4 nm-class technology for integration into stacked 3D designs.
Samsung plans to disclose key details about its SF2 fabrication technology at the VLSI Symposium 2024 on June 19. This will be the company's second major process node based upon gate-all-around (GAA) multi-bridge channel field-effect transistors (MBCFET). Improving over its predecessor, SF2 will feature a 'unique epitaxial and integration process,' which will give the process node higher performance and lower leakage than traditional FinFET-based nodes (though Samsung isn't disclosing the specific node they're comparing it to).
Samsung says that SF2 increases performance of narrow transistors by 29% for N-type and 46% for P-type, and wide transistors by 11% and 23% respectively. Moreover, it reduces transistor global variation by 26% compared to FinFET technology, and cuts product leakage by approximately 50%. This process also sets the stage for future advancements in technology through enhanced design technology co-optimization (DTCO) collaboration with its customers.
One thing that Samsung has not mentioned in context of SF2 is backside power delivery, so at least for the moment, there is no indication that Samsung will be adopting this next-gen power routing feature for SF2.
Samsung says that the design infrastructure for SF2 – the PDK, EDA tools, and licensed IP – will be finalized in the second quarter of 2024. Once this happens, Samsung's chip development partners will be able to begin designing products for this production node. Meanwhile, Samsung is already working with Arm to co-optimize Arm's Cortex cores for the SF2 process.
As the first fab to introduce a GAAFET-based node, Samsung has been on the cutting edge of chip construction. At the same time, however, that has also meant that they're the first fab to encounter and solve the inevitable teething issues that come with such a major transistor design change. Consequently, while Samsung's first-generation SF3E process technology has been in production for a little less than two years now, the only publicly-disclosed chips made on the process so far have been relatively small cryptocurrency mining chips – exactly the kind of pipecleaner parts that do well on a new process node.
But with that experience in hand, Samsung is preparing to move on to making bigger and better chips with GAAFETs. As part of their earnings announcements, the company has confirmed that their updated SF3 node, which was introduced last year, remains on schedule to enter production in the second half of 2024.
A more mature product from the get-go, SF3 is being prepared to be used for building larger processors, including datacenter products. Compared to its direct predecessor, SF4, SF3 promises a 22% performance boost at the same power and transistor count, or a 34% lower power at the same frequency and complexity, as well as a 21% logic area reduction. In general, Samsung pins a lot of hopes on this technology, as it's this generation of their 3nm-class technology that is poised to compete against TSMC's N3B and N3E nodes.
Finally, Samsung is also preparing a variant of their final FinFET technology node, SF4, for use in 3D chiplet stacking. As transistor density improvements have continued to slow, 3D chip stacking has emerged as a way to keep boosting overall chip performance, especially with modern, multi-tile processor designs.
Details on this node are limited, but it would seem that Samsung is making some changes to account/optimize for using SF4-fabbed chiplets in a 3D-stacked design, where chips need to be able to communicate both up and down. According to the company's Q1 financial report, Samsung expects to complete their preparatory work on the chip-stacking SF4 variant during the current quarter (Q2).
Si les prix des SSD NVMe se sont globalement envolés depuis maintenant quelques mois, force est de constater que l'augmentation n'affecte pas de la même manière toutes les capacités ni toutes les gammes.Ainsi, les modèles 1 To d'entrée de gamme par exemple se sont prix une claque monumentale puisqu...
Alors qu'on les voyait régulièrement en promotion vers 200 € ces dernières années, les promotions autour des célèbres volants G920 et G29 de Logitech se font beaucoup plus rares ces derniers temps, au point qu'elles ont été quasi inexistantes en 2024. Si vous rongiez votre frein dans l'attente d'une...
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Avec DRAGON BALL: Sparking! ZERO, les fans de la série Budokai Tenkaichi devraient être plus que ravis. Les vidéos présentées envoient du lourd, et la nouvelle publiée hier ne fait que suivre cette tendance. Mais surtout, le roster se dévoile de plus en plus et devrait satisfaire les amateurs de la célèbre franchise en piochant dans toutes les sagas. Nul doute que tout le monde trouvera au moins un personnage favori ! […]
Lire la suiteSteelSeries, la marque esports originale qui fusionne le jeu vidéo et la culture, présente aujourd'hui une toute nouvelle version blanche des casques Arctis Nova Pro, maintes fois primés. Il y a des moments décisifs dans chaque industrie et à chaque époque : En 2022, SteelSeries a lancé la gamme Arctis Nova Pro, qui a remporté d'innombrables prix et a été saluée par la critique, tout en établissant une toute nouvelle catégorie premium/luxe/haut de gamme sur le marché des casques de jeu. […]
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Nouvelle montée en gamme chez CORSAIR avec les nouveaux ventilateurs RS MAX qui mesurent 30 mm d'épaisseur. Un gain de 5 mm par rapport à un modèle classique qui permet d'augmenter sensiblement les performances, et c'est ce que vise cette gamme. Sans éclairage RGB et avec des pales en polymère à cristaux liquides, la série se décline en 120 mm et en 140 mm afin de répondre à de nombreux besoins. Ce premier est vendu à l'unité et en pack de trois, à respectivement 43.56 U+20AC et 118.25 U+20AC, tandis que le second est proposé seul ou par deux à 49.78 U+20AC et 93.35 U+20AC. Un positionnement élitiste ? […]
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