Raspberry Pi has announced the Pico 2 W, a wireless version of its Pico 2 microcontroller board built for hobbyists and industrial applications. From a report: At $7, it's a relatively inexpensive way to control electronic devices like smart home gadgets and robots. With the new version, users will be able to securely link to remote sources to send and receive data, either via Bluetooth 5.2 or Wi-Fi 802.11n. As with the Pico 2, the wireless variant is built around the RP2350 microcontroller built in-house by Raspberry Pi. it offers more speed and memory than the original RP2040 chip, along with a security model built around Arm's TrustZone for Cortex-M. Users can program it using C, C++ and MicroPython, and choose between Arm Cortex-M33 or RISC-V cores.

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An anonymous reader quotes a report from The Register: Framework CEO Nirav Patel had one of the bravest tech demos that we've seen at a conference yet -- modifying a Framework Laptop from x86 to RISC-V live on stage. In the five-minute duration of one of the Ubuntu Summit's Lightning Talks, he opened up a Framework machine, removed its motherboard, installed a RISC-V-powered replacement, reconnected it, and closed the machine up again. All while presenting the talk live, and pretty much without hesitation, deviation, or repetition. It was an impressive performance, and you can watch it yourself at the 8:56:30 mark in the video recording. Now DeepComputing is taking orders for the DC-ROMA board, at least to those in its early access program. The new main board is powered by a StarFive JH7110 System-on-Chip. (Note: there are two tabs on the page, for both the JH7110 and JH7100, and we can't link directly to the latter.) CNX Software has more details about the SoC. Although the SoC has six CPU cores, two are dedicated processors, making it a quad-core 64-bit device. The four general-purpose cores are 64-bit and run at up to 1.5 GHz. It supports 8 GB of RAM and eMMC storage. [...] In our opinion, RISC-V is not yet competitive with Arm in performance. However, this is a real, usable, general-purpose computer, based on an open instruction set. That's no mean feat, and it's got more than enough performance for less demanding work. It's also the first third-party main board for the Framework hardware, which is another welcome achievement. The company has now delivered several new generations of hardware, including a 16-inch model, and continues to upgrade its machines' specs.

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"Researchers at the University of Texas have unveiled a new thermal interface material that could revolutionize cooling, outperforming top liquid metal solutions by up to 72% in heat dissipation," writes Slashdot reader jjslash. "This breakthrough not only improves energy efficiency but also enables higher-density data center setups, cutting cooling costs and energy usage significantly." TechSpot reports: Thanks to a mechanochemically engineered combination of the liquid metal alloy Galinstan and ceramic aluminum nitride, this thermal interface material, or TIM, outperformed the best commercial liquid metal cooling products by a staggering 56-72% in lab tests. It allowed dissipation of up to 2,760 watts of heat from just a 16 square centimeter area. The material pulls this off by bridging the gap between the theoretical heat transfer limits of these materials and what's achieved in real products. Through mechanochemistry, the liquid metal and ceramic ingredients are mixed in an extremely controlled way, creating gradient interfaces that heat can flow across much more easily. Beyond just being better at cooling, the researchers claim that the higher performance reduces the energy needed to run cooling pumps and fans by up to 65%. It also unlocks the ability to cram more heat-generating processors into the same space without overheating issues. [...] As for how you can get your hands on the material: it's yet to make it out of the labs. The UT team has so far only tested it successfully at small scales but is now working on producing larger batches to put through real-world trials with data center partners. The material has been detailed in a paper published in the journal Nature Nanotechnology.

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Communications of the ACM checks in on the quest for room-temperature superconductivity. "Time and time again, physicists have announced breakthroughs that were later found to be irreproducible, in error, or even fraudulent." But "The issue is once again simmering..." In January 2024, a group of researchers from Europe and South America announced they had achieved a milestone in room-temperature ambient-pressure superconductivity. Using Scotch-taped cleaved pyrolytic graphite with surface wrinkles, which formed line defects, they observed a room-temperature superconducting state. Their paper, published in the journal Advanced Quantum Technologies, has gained considerable attention in the scientific world... Although many in the scientific community remain incredulous, if valid, this development could help solve a key piece of the puzzle: how defects and wrinkles in a material such as scotch-taped cleaved pyrolytic graphite (HOPG) affect electrical properties and behavior within superconductive systems... "We haven't reached a point where there is a clear path to room temperature superconductivity because researchers are either overly enthusiastic or deceptive," said Elie Track, chief technology officer at HYPRES, Inc., an Elmsford, NY, company that develops and commercializes superconductor integrated circuits (ICs) and systems. "People fail to check measurements and others can't reproduce their results. There is a lot of carelessness and sloppy science surrounding the space because people are so eager to achieve success." The team conducting research into scotch-taped cleaved pyrolytic graphite believe their discovery could tilt the search for practically useful room-temperature superconductivity in a favorable direction. They reported they were able to achieve one-dimensional superconductivity in pyrolytic graphite at temperatures as great as 300 degrees Kelvin (26.85 degrees Celsius), and at ambient pressure. Vinokur and physicist Maria Cristina Diamantini described the development as the first "unambiguous experimental evidence" for a global room temperature zero-resistance state. If true, the team's research could illuminate a path to new superconducting materials.... Others remain skeptical, however. For example Alan Kadin [a technical consultant in the field and a former professor of electrical engineering at the University of Rochester] pointed out that one of the key researchers for the project, Yakov Kopelevich, has been working in the field for two decades and, so far, "The results are not reproducible in other labs...Until someone else independently reproduces these results, I think we can safely ignore them," he argued... Yet as scientists continue to bang away at the superconducting challenge — including the possibility of using generative AI to explore materials and techniques — optimism is growing that a major breakthrough could occur.

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Longtime Slashdot reader Baron_Yam writes: Memristors are the long-sought 4th fundamental circuit element. They promise analog computing capability in hardware, the ability to hold state without power, and to work with less power. A small cluster of them can replace a transistor using less space. Working and long term storage can blend together and neural networks can be implemented in hardware -- they are a game-changing innovation. Now, researchers are getting closer to putting these into production as they can now produce graphene-based memristors at wafer scale. "One of the key challenges in memristor development is device degradation, which graphene can help prevent," reports Phys.Org. "By blocking chemical pathways that degrade traditional electrodes, graphene could significantly extend the lifetime and reliability of these devices. Its remarkable transparency, transmitting 98% of light, also opens doors to advanced computing applications, particularly in AI and optoelectronics." The findings have been published in the journal ACS Advanced Electronic Materials.

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An anonymous reader quotes a report from Ars Technica: Qualcomm has a new chip for flagship phones, and the best part is that it uses an improved version of the Oryon CPU architecture that the Snapdragon X Elite chips brought to Windows PCs earlier this year. The Snapdragon 8 Elite is the follow-up to last year's Snapdragon 8 Gen 3 -- yet another change to the naming convention that Qualcomm uses for its high-end phone chips, though, as usual, the number 8 is still involved. The 8 Elite uses a "brand-new, 2nd-generation Qualcomm Oryon CPU" with clock speeds up to 4.32 GHz, which Qualcomm says will improve performance by about 45 percent compared to the Snapdragon 8 Gen 3. Rather than a mix of large, medium, and small CPU cores as it has used in the past, the 8 Elite has two "Prime" cores for hitting that high peak clock speed, while the other six are all "Performance" cores that peak at a lower 3.53 GHz. But it doesn't look like Qualcomm is using a mix of different CPU architectures anymore, choosing to distinguish the higher-performing core from the lower-performing ones by clock speed alone. Qualcomm promises a similar 40 percent performance boost from the new Adreno 830 GPU. The chip also includes a marginally improved Snapdragon X80 5G modem, up from an X75 modem in the Snapdragon 8 Gen 3 -- its main improvement appears to be support for additional antennas, for a total of six, but the download speed still tops out at a theoretical 10Gbps. Wi-Fi 7 support appears to be the same as in the 8 Gen 3, but the 8 Elite does support the Bluetooth 6.0 standard, up from Bluetooth 5.4 in the 8 Gen 3. Qualcomm says the new chip's CPU features "44% improved power efficiency" and "40% greater power efficiency" for the GPU, which ought to keep power usage in line despite the performance improvements -- these gains are probably attributable to the new 3 nm TSMC manufacturing process, compared to the 4 nm process used for the Snapdragon 8 Gen 3. And no 2024 chip announcement would be complete without some kind of AI mention: Qualcomm's image signal processor is now an "AI ISP," which Qualcomm says "recognizes and enhances virtually anything in the frame, including faces, hair, clothing, objects, backgrounds, and beyond." These capabilities can allow it to remove objects from the background of photos, among other things, using the on-device processing power of the chip's Hexagon neural processing unit (NPU). The NPU is 45 percent faster than the one in the Snapdragon 8 Gen 3. Phones using the Snapdragon 8 Elite should begin appearing in "the coming weeks."

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In a new teardown video published last week, iFixit reveals a Quest 2 headset "hiding inside" the cheaper yet enhanced Quest 3S. The Verge reports: The first hint of that is the headset's Fresnel lenses, which iFixit's Shahram Mokhtari writes in a blog post are "100% compatible" with those used by the Quest 2. The headset has the older headset's IPD adjustment mechanism, as well; and it shares the same single LCD panel, rather than using one panel per eye, like the Meta Quest 3. Legacy parts aside, iFixit found that the 3S uses two IR sensors for depth mapping instead of a single depth sensor. That "rare iterative improvement over the Quest 3" performed "exceptionally well in unlit spaces," Mokhtari writes in the blog. And of course, it uses the same Qualcomm Snapdragon XR2 SoC as the Quest 3, and works with Meta's newer Touch Plus controllers, which are sold separately. The Quest 3S "costs $299.99, while the Quest 3 is $499.99," notes The Verge. So, not only is the 3S cheaper but replacement parts should be easier to find since the Quest 2 "has already been around for four years."

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Amazon has unveiled its first color e-reader, the Kindle Colorsoft Signature Edition, priced at $279.99. The 7-inch device, available for preorder with shipments starting October 30th, utilizes E Ink's Kaleido technology and a new display stack. Kevin Keith, head of Kindle products, claims the Colorsoft maintains Kindle's hallmark features while introducing color without compromising performance. The e-reader boasts a 300ppi screen, enhanced LED pixels, and improved light distribution for vivid colors. It offers faster page turns and book openings compared to previous models. The color screen enhances the user interface, allowing for full-color book covers and a more vibrant standby display.

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Global semiconductor sales recorded a 20.6% year-on-year increase in August to $53.1 billion, according to the Semiconductor Industry Association (SIA). The Register reports: The Americas led the way, with sales up 43.9 percent to $15.4 billion over last year to notch up what may be the highest on record for August, the SIA said. This comes on the back of swelling demand from sectors such as AI, cloud computing, and automotive. Over in Asia-Pacific sales grew year-on-year by 17.1 percent to $10.95 billion, according to the World Semiconductor Trade Statistics organization, which compiles these stats for the SIA. China was up 19.2 percent to $13 billion and Japan grew two percent to $4 billion. Europe was the outlier, recording a nine percent drop to $4.7 billion. No reason was given for this decline. However, on a worldwide basis, all continents returned positive month-on-month numbers in August for the first time since October 2023, indicating that the semiconductor industry is on a path to recovery.

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